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NDC7002ND87Z

Onsemi

NDC7002ND87Z by Onsemi

NDC7002ND87Z by Onsemi is a N-CHANNEL FET with 50V DS breakdown voltage, 0.51A ID, and 2 ohm RDS. Ideal for switching applications, it operates in enhancement mode with 1.4W max power dissipation at 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,507 parts In-Stock

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Digiode

USA . 3,358 parts In-Stock

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Anansix

USA . 1,382 parts In-Stock

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Kulean Microsystems

USA . 8,285 parts In-Stock

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Problanco Electronics

Mexico . 4,518 parts In-Stock

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TANS Electronics

Latvia . 3,240 parts In-Stock

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SupplyDigital Components

Austria . 1,016 parts In-Stock

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Corphita

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Corohmni

South Africa . 124 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 44 parts In-Stock

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Overview

Experience the reliability and performance of the NDC7002ND87Z by Onsemi, a top-tier manufacturer known for its superior quality products. This Small Signal Field Effect Transistor is perfect for switching applications, offering enhanced power dissipation and a maximum breakdown voltage of 50V. With a compact rectangular package and gull wing terminals, this N-Channel transistor provides seamless installation and operation. Trust in Onsemi to deliver cutting-edge technology and unmatched durability with the NDC7002ND87Z, ensuring optimal functionality and efficiency in your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product a good choice for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it efficient and reliable for tasks that require fast switching speeds.

Minimum DS Breakdown Voltage: 50V

With a minimum breakdown voltage of 50V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Maximum Power Dissipation (Abs): 0.96W

Can dissipate relatively high amounts of power without getting damaged, ensuring stable performance even under heavy loads.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low output resistance, making them suitable for a wide range of applications where high performance is required.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without issues, making it suitable for applications where heat dissipation is a concern.

Maximum Drain Current (ID): 0.51A

Capable of handling relatively high drain currents, making it suitable for applications that require high current capabilities.

Maximum Drain-Source On Resistance: 2 ohm

Low on-resistance ensures minimal power loss and higher efficiency in switching applications.

Maximum Feedback Capacitance (Crss): 5pF

Lower feedback capacitance helps in reducing signal distortion and improving overall performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NDC7002ND87Z attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (ID):

.51 A

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

1.4 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDC7002ND87Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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