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CPH3356-TL-H

Onsemi

CPH3356-TL-H by Onsemi

CPH3356-TL-H by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a max ID of 2.5A and 0.137 ohm RDS(ON). Featuring GULL WING terminals, this MOSFET operates in ENHANCEMENT MODE for efficient performance.

Median Price

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Lifecycle Status

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6

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1k+

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Chip Stock

USA . 5,900 parts In-Stock

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Digiode

USA . 1,998 parts In-Stock

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1,998

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 436 parts In-Stock

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436

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ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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70

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Holdelec - ElecDif-Pro

France . 70 parts In-Stock

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70

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Aztec Data Supply Inc.

USA . 270 parts In-Stock

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$1.700

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270

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AZTECH Wire

Italy . 436 parts In-Stock

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$12.502

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Semicontronic

India . 292 parts In-Stock

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$50.050

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$48.799

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$48.548

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Kepictronics

USA . 38,790 parts In-Stock

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Problanco Electronics

Mexico . 7,633 parts In-Stock

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Kulean Microsystems

USA . 3,455 parts In-Stock

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Continental Prestige Electronics

USA . 3,098 parts In-Stock

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TANS Electronics

Latvia . 2,278 parts In-Stock

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Argo Parts USA

USA . 1,930 parts In-Stock

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SupplyDigital Components

Austria . 1,891 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 571 parts In-Stock

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Corphita

USA . 504 parts In-Stock

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Corohmni

South Africa . 414 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Enhance your electronic designs with the CPH3356-TL-H from Onsemi. As a leading manufacturer of Small Signal Field Effect Transistors, Onsemi ensures top-quality components for reliable performance. This P-CHANNEL transistor is perfect for switching applications, offering a built-in diode for added convenience. Its compact size and surface mount capability make it easy to integrate into your projects. With a low on resistance and high drain current, this transistor delivers efficient power handling. Trust Onsemi for superior components that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

Allows for efficient current flow and switching capabilities in the circuit.

Configuration: SINGLE WITH BUILT-IN DIODE

Includes a built-in diode for added functionality in circuit designs.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Facilitates easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 20 V

Can handle up to 20 volts of breakdown voltage, providing a good safety margin in various applications.

Package Shape: RECTANGULAR

Enables compact and efficient placement on circuit boards.

Terminal Form: GULL WING

Provides stable and reliable connections during installation.

Operating Mode: ENHANCEMENT MODE

Enhances the performance and efficiency of the transistor during operation.

No. of Terminals: 3

Simple and straightforward terminal configuration for ease of use.

Package Style (Meter): SMALL OUTLINE

Compact design that saves space on the circuit board.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Advanced technology that offers high performance and reliability.

Transistor Element Material: SILICON

Utilizes high-quality silicon material for better conductivity and performance.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Provides a reliable and durable finish for the terminals of the transistor.

Maximum Drain Current (ID): 2.5 A

Capable of handling up to 2.5 amps of drain current, suitable for various applications.

Maximum Drain-Source On Resistance: 0.137 ohm

Low on-resistance ensures efficient power handling and minimal heat generation.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit design and installation.

Technical Specifications

Small Signal Field Effect Transistors (FET) CPH3356-TL-H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

.137 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CPH3356-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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