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CPH3348-TL-W

Onsemi

CPH3348-TL-W by Onsemi

CPH3348-TL-W by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, 0.07 ohm RDS(on), and 3A ID. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at up to 150 °C. This SMALL OUTLINE transistor features GULL WING terminals and METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$0.142

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1 parts In-Stock

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$0.114

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1

$0.114

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Rochester

USA . 6,000 parts In-Stock

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$0.169

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$0.140

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$0.125

6,000

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$0.169

$0.140

$0.125

Distributors (In-Stock)

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Digiode

USA . 1,808 parts In-Stock

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$0.053

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Chip Stock

USA . 32,000 parts In-Stock

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Vyrian

USA . 12,135 parts In-Stock

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Flip Electronics

USA . 9,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,199 parts In-Stock

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SPM Sales

USA . 36 parts In-Stock

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Corphita

USA . 2,279 parts In-Stock

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$0.050

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2,279

$0.050

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Corohmni

South Africa . 213 parts In-Stock

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$0.056

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213

$0.056

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Ampacity Inc.

Singapore . 2,888 parts In-Stock

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$0.104

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$0.104

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Native Components

USA . 36 parts In-Stock

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$0.108

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$0.104

36

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Northwest PG Solutions

USA . 821 parts In-Stock

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$0.119

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$0.105

821

$0.119

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$0.105

Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.234

100+ parts

$2.033

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$1.832

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$2.234

$2.033

$1.832

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AZTECH Wire

Italy . 1,136 parts In-Stock

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$17.880

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,052 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 7,778 parts In-Stock

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Kulean Microsystems

USA . 5,380 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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iodParts Technologies Inc.

India . 1,999 parts In-Stock

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TANS Electronics

Latvia . 1,503 parts In-Stock

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UHIMA Technologies

Türkiye . 563 parts In-Stock

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SupplyDigital Components

Austria . 153 parts In-Stock

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Overview

Unleash the power of innovation with the CPH3348-TL-W by Onsemi! Crafted with precision and quality, this P-Channel small signal field effect transistor is designed for switching applications with a single configuration and built-in diode. With its compact design and high-performance capabilities, this FET offers reliable operation and efficiency. Whether you're in the automotive industry, consumer electronics, or industrial automation, this innovative product delivers value and benefits to meet your needs. Trust Onsemi for cutting-edge technology that propels your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the transistor lightweight and cost-effective.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their high input impedance, which can be advantageous in many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient performance.

Surface Mount: YES

Surface mount technology allows for easier and more compact PCB design.

Minimum DS Breakdown Voltage: 12 V

The 12V breakdown voltage ensures the transistor can handle higher voltages without breakdown.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space on the PCB.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and durability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the output signal.

No. of Terminals: 3

Three terminals provide the necessary connections for proper operation.

Maximum Power Dissipation (Abs): 1 W

The 1W power dissipation rating allows for reliable operation without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides better performance and efficiency.

Maximum Operating Temperature: 150 °C

The 150 °C operating temperature rating ensures the transistor can operate in a wide range of environments.

Transistor Element Material: SILICON

Silicon material offers excellent electrical properties for transistor operation.

Terminal Finish: TIN BISMUTH

Tin bismuth finish provides good solderability and durability.

Maximum Drain Current (ID): 3 A

The 3A maximum drain current rating allows the transistor to handle higher current loads.

Maximum Drain-Source On Resistance: 0.07 ohm

Low on-resistance (0.07 ohm) ensures efficient switching and minimal power loss.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

The 260 °C peak reflow temperature ensures reliable soldering connections.

Technical Specifications

Small Signal Field Effect Transistors (FET) CPH3348-TL-W attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CPH3348-TL-W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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