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CPH3448-TL-H

Onsemi

CPH3448-TL-H by Onsemi

CPH3448-TL-H by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 4A ID, and 0.05 ohm RDS. It's a small outline transistor ideal for applications requiring high drain current and low on-resistance in enhancement mode operation.

Median Price

$0.750

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,875 parts In-Stock

1+ parts

$0.750

100+ parts

$0.375

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$0.150

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1,875

$0.750

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Chip Stock

USA . 31,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,875 parts In-Stock

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1,875

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Dan-Mar Components

USA . 1,875 parts In-Stock

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1,875

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Digiode

USA . 1,636 parts In-Stock

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1,636

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Vyrian

USA . 1,537 parts In-Stock

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Native Components

USA . 519 parts In-Stock

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$1.090

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519

$1.090

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Northwest PG Solutions

USA . 2,071 parts In-Stock

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$1.199

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$1.199

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Kepictronics

USA . 44,792 parts In-Stock

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Kulean Microsystems

USA . 4,513 parts In-Stock

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TANS Electronics

Latvia . 3,888 parts In-Stock

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SupplyDigital Components

Austria . 3,304 parts In-Stock

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Problanco Electronics

Mexico . 2,372 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 1,064 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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383

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Corphita

USA . 238 parts In-Stock

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UHIMA Technologies

Türkiye . 224 parts In-Stock

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Overview

Enhance your electronic designs with the CPH3448-TL-H from Onsemi, a top-tier manufacturer known for quality and innovation. This Small Signal Field Effect Transistor offers reliable performance and efficiency, making it ideal for a wide range of applications. From power management to signal amplification, this N-channel transistor with a built-in diode delivers exceptional value and benefits to customers. Trust Onsemi's expertise and choose the CPH3448-TL-H for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material makes the transistor lightweight and durable, suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL polarity or channel type allows for efficient current flow in one direction, making it ideal for high-performance circuits.

Maximum Power Dissipation (Abs): 1 W

With a maximum power dissipation of 1 W, this transistor can handle high power levels without overheating, ensuring reliability in operation.

Maximum Operating Temperature: 150 °C

The maximum operating temperature of 150 °C allows this transistor to function efficiently in a wide range of environments, enhancing its versatility.

Maximum Drain Current (ID): 4 A

A maximum drain current of 4 A indicates that this transistor can handle high currents, making it suitable for applications requiring robust performance.

Maximum Drain-Source On Resistance: 0.05 ohm

With a low drain-source on resistance of 0.05 ohm, this transistor minimizes power loss and improves overall efficiency in circuit applications.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures secure soldering connections during manufacturing, contributing to the reliability of the product.

Technical Specifications

Small Signal Field Effect Transistors (FET) CPH3448-TL-H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

CPH3448-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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