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CPH3355-TL-H

Onsemi

CPH3355-TL-H by Onsemi

CPH3355-TL-H by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage and 2.5A ID. It operates in Enhancement Mode, has 0.156 ohm RDS(on), and can handle up to 1W power dissipation. Ideal for small outline applications requiring high drain current and low on-resistance.

Median Price

$0.139

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 270 parts In-Stock

1+ parts

$1.285

100+ parts

$1.169

1k+ parts

$1.054

10k+ parts

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270

$1.285

$1.169

$1.054

-

Rochester

USA . 170,118 parts In-Stock

1+ parts

-

100+ parts

$0.139

1k+ parts

$0.115

10k+ parts

$0.103

170,118

-

$0.139

$0.115

$0.103

DigiKey

USA . 170,118 parts In-Stock

1+ parts

-

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$0.170

170,118

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$0.170

Verical

USA . 170,118 parts In-Stock

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$0.128

170,118

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$0.128

Chip1Stop

Japan . 4 parts In-Stock

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-

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$0.121

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-

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4

-

$0.121

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Distributors (In-Stock)

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Vyrian

USA . 269 parts In-Stock

1+ parts

$0.095

100+ parts

-

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269

$0.095

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Digiode

USA . 828 parts In-Stock

1+ parts

$0.108

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-

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828

$0.108

-

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Bristol Electronics

USA . 1,510 parts In-Stock

1+ parts

$0.420

100+ parts

$0.155

1k+ parts

$0.109

10k+ parts

-

1,510

$0.420

$0.155

$0.109

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DigiKey Marketplace

USA . 176,711 parts In-Stock

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176,711

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Chip Stock

USA . 21,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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ACDS - Activité Composants Distribution Service

France . 1,510 parts In-Stock

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Dan-Mar Components

USA . 1,510 parts In-Stock

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1,510

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Distributors (Availability)

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Corohmni

South Africa . 263 parts In-Stock

1+ parts

$0.095

100+ parts

-

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263

$0.095

-

-

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Corphita

USA . 792 parts In-Stock

1+ parts

$0.103

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792

$0.103

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Component Stockers USA

USA . 133,532 parts In-Stock

1+ parts

$0.120

100+ parts

$0.110

1k+ parts

$0.100

10k+ parts

$0.100

133,532

$0.120

$0.110

$0.100

$0.100

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$1.285

100+ parts

$1.169

1k+ parts

$1.054

10k+ parts

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270

$1.285

$1.169

$1.054

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Native Components

USA . 264 parts In-Stock

1+ parts

$1.836

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264

$1.836

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Northwest PG Solutions

USA . 2,188 parts In-Stock

1+ parts

$2.020

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2,188

$2.020

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Continental Prestige Electronics

USA . 178,801 parts In-Stock

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$0.104

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178,801

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$0.104

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Metaverse IC Inc.

Canada . 96,000 parts In-Stock

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Kepictronics

USA . 44,789 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,417 parts In-Stock

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Perfect Parts

USA . 8,557 parts In-Stock

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TANS Electronics

Latvia . 4,519 parts In-Stock

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Problanco Electronics

Mexico . 2,903 parts In-Stock

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Kulean Microsystems

USA . 2,819 parts In-Stock

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SupplyDigital Components

Austria . 2,505 parts In-Stock

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UHIMA Technologies

Türkiye . 806 parts In-Stock

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806

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Overview

Enhance your electronic designs with the CPH3355-TL-H by Onsemi. This small signal field-effect transistor offers reliable performance and high-quality construction, thanks to its manufacturer's expertise in semiconductor technology. Ideal for various applications, this P-channel FET provides exceptional value and benefits to customers seeking a single configuration with a built-in diode. Trust in Onsemi for cutting-edge technology that delivers superior power dissipation, enhanced efficiency, and optimal operating temperatures. Upgrade your projects with the CPH3355-TL-H and experience the advantages of top-notch transistor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, ideal for portable and rugged applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors generally have lower ON-state resistance and higher current handling capabilities compared to N-channel transistors, making this transistor suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage spikes, enhancing the reliability of the overall system.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage ensures that the transistor can withstand higher voltage levels, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Power Dissipation (Abs): 1 W

With a high maximum power dissipation, this transistor can handle high power levels without getting damaged, making it reliable in demanding environments.

Maximum Drain Current (ID): 2.5 A

The high maximum drain current allows the transistor to handle large amounts of current without overheating, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.156 ohm

The low ON resistance results in minimal power loss and heat generation, improving efficiency and overall performance of the transistor.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can operate reliably in elevated temperature environments, making it suitable for industrial applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) CPH3355-TL-H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

2.5 A

Maximum Drain-Source On Resistance:

.156 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

CPH3355-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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