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NTR4503NT1G

Onsemi

NTR4503NT1G by Onsemi

NTR4503NT1G by Onsemi is a N-CHANNEL FET with 30V DS breakdown voltage, 1.5A max drain current, and 0.11 ohm max on resistance. Ideal for switching applications due to its single configuration with built-in diode. Operates in enhancement mode, surface mountable, and has a max operating temperature of 150°C.

Median Price

$0.126

Lifecycle Status

Suppliers In-Stock

42

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1k+

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Newark

USA . 2,597 parts In-Stock

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Mouser Electronics

USA . 13,954 parts In-Stock

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DigiKey

USA . 8,214 parts In-Stock

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Flip Electronics (Authorized)

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Chip1Stop

Japan . 142,000 parts In-Stock

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Verical

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Canada . 33,000 parts In-Stock

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Master Electronics

USA . 22,250 parts In-Stock

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Rochester

USA . 16,110 parts In-Stock

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RS (Exports)

UK . 15,275 parts In-Stock

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Arrow

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Farnell

UK . 13,670 parts In-Stock

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Element14

Singapore . 13,670 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,241 parts In-Stock

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Nova Conductors

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TME

Poland . 1,662 parts In-Stock

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Maritex

Poland . 14,440 parts In-Stock

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Component Sense

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NAC Semi

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Bristol Electronics

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Ampacity Inc.

Singapore . 120,849 parts In-Stock

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Semicontronic

India . 113,727 parts In-Stock

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Corohmni

South Africa . 174 parts In-Stock

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Corphita

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Aranea Global

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Aztec Data Supply Inc.

USA . 4,514 parts In-Stock

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Benley Electronics

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Advanced Electronics

New Zealand . 15 parts In-Stock

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Perfect Parts

USA . 2,709,665 parts In-Stock

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RC Electronics

USA . 75,987 parts In-Stock

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GreenTree Electronics

Israel . 75,000 parts In-Stock

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ChipstoGo Electronic ltd

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Continental Prestige Electronics

USA . 30,000 parts In-Stock

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Lixinc

USA . 6,514 parts In-Stock

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SupplyDigital Components

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Israel . 3,000 parts In-Stock

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iodParts Technologies Inc.

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Germany . 2,160 parts In-Stock

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Overview

Unleash the power of innovation with the NTR4503NT1G by Onsemi! This small signal field effect transistor is a game-changer in the world of switching applications. With its high-quality construction and cutting-edge technology, this N-channel transistor offers unparalleled performance and reliability. Its single configuration with a built-in diode provides added convenience and efficiency. Say goodbye to limitations and hello to endless possibilities with the NTR4503NT1G. Elevate your projects to new heights with this exceptional product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the transistor lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower ON resistance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse voltage protection, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Suitable for surface mount applications, making it easier to integrate into electronic circuits.

Minimum DS Breakdown Voltage: 30 V

A relatively high breakdown voltage ensures the transistor can handle higher voltages without damage.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer easier control of the ON/OFF state, enhancing efficiency in switching applications.

Maximum Drain Current (ID): 1.5 A

The high maximum drain current allows the transistor to handle higher current loads, suitable for various applications.

Maximum Power Dissipation: 0.73 W

With a relatively high maximum power dissipation, the transistor can handle moderate power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance characteristics, making this transistor reliable and efficient.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the transistor to operate in a wide range of temperature environments.

Maximum Drain-Source On Resistance: 0.11 ohm

The low drain-source on resistance results in minimal power loss and improved efficiency in switching operations.

Maximum Feedback Capacitance (Crss): 25 pF

Low feedback capacitance ensures stability in high-frequency applications, making this transistor suitable for such scenarios.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR4503NT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.5 A

Maximum Drain Current (ID):

1.5 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4503NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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