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NTR4170NT3G

Onsemi

NTR4170NT3G by Onsemi

NTR4170NT3G by Onsemi is a N-CHANNEL FET with 30V DS breakdown voltage, 3.2A max drain current, and 0.055 ohm max on resistance. Ideal for switching applications due to its single configuration with built-in diode. Operates in enhancement mode at up to 150 °C, making it suitable for various electronic devices.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Chip Stock

USA . 524,799 parts In-Stock

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Vyrian

USA . 4,670 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 151 parts In-Stock

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$15.150

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Component Stockers USA

USA . 725 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 125,880 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

USA . 17,462 parts In-Stock

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Kulean Microsystems

USA . 8,251 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,738 parts In-Stock

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Problanco Electronics

Mexico . 6,593 parts In-Stock

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TANS Electronics

Latvia . 4,325 parts In-Stock

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Corphita

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SupplyDigital Components

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Corohmni

South Africa . 151 parts In-Stock

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UHIMA Technologies

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Overview

Enhance your electronic projects with the high-quality NTR4170NT3G by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-notch Small Signal Field Effect Transistors that are perfect for switching applications. With a maximum drain current of 3.2 A and a low drain-source on resistance of 0.055 ohm, this N-channel transistor offers exceptional performance and reliability. Whether you're a hobbyist or a professional, this product's built-in diode, small outline package style, and gull wing terminals provide convenience and versatility for all your projects. Upgrade your circuits today with the NTR4170NT3G and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for easy integration into circuits that require N-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide additional protection for the transistor and surrounding components.

Transistor Application: SWITCHING

Ideal for applications that require fast switching speeds and efficient power management.

Surface Mount: YES

Facilitates easy and secure mounting onto circuit boards, saving space and making assembly more efficient.

Minimum DS Breakdown Voltage: 30 V

Suitable for applications that require a breakdown voltage of up to 30 volts.

Package Shape: RECTANGULAR

Allows for easy placement and orientation on circuit boards, optimizing space usage.

Terminal Form: GULL WING

Provides strong mechanical support and easy soldering connections.

Operating Mode: ENHANCEMENT MODE

Enables precise control over the switching behavior of the transistor.

Maximum Drain Current (Abs) (ID): 3.2 A

Can handle high current loads, making it suitable for a variety of applications.

No. of Terminals: 3

Simple and straightforward connection setup.

Maximum Power Dissipation (Abs): 1.25 W

Can handle power dissipation effectively, ensuring reliability under load.

Package Style (Meter): SMALL OUTLINE

Compact size for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and performance for switching applications.

Maximum Operating Temperature: 150 °C

Can operate effectively under high-temperature conditions, expanding its range of applications.

Transistor Element Material: SILICON

Offers reliability and high performance, ensuring consistent operation over time.

Terminal Finish: Tin (Sn)

Resistant to corrosion and provides a reliable electrical connection.

Maximum Drain-Source On Resistance: 0.055 ohm

Low on-resistance for efficient power management and minimal voltage drop.

Terminal Position: DUAL

Provides flexibility in circuit design and connection options.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR4170NT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4170NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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