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NTR4502PT3G

Onsemi

NTR4502PT3G by Onsemi

NTR4502PT3G by Onsemi is a P-CHANNEL FET with 30V DS breakdown voltage, ideal for switching applications. It features a max ID of 1.95A and 0.2 ohm RDS(on), operating in enhancement mode at up to 150 °C. This small outline transistor with GULL WING terminals is designed for surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 664,000 parts In-Stock

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USA . 568,000 parts In-Stock

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Vyrian

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Martec Srl

Italy . 2,980 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 912 parts In-Stock

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Kepictronics

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Kulean Microsystems

USA . 7,824 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 2,747 parts In-Stock

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Problanco Electronics

Mexico . 2,642 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 984 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the NTR4502PT3G by Onsemi. As a leader in small signal field effect transistors, Onsemi delivers top-quality products designed for superior performance and reliability. Ideal for switching applications, this P-channel transistor offers enhanced capabilities and efficiency, making it the perfect choice for a wide range of electronic devices. Trust Onsemi to provide you with the value, benefits, and advantages you need to take your projects to the next level. Elevate your designs with the NTR4502PT3G and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

Suitable for switching applications and can handle high voltage levels.

Transistor Application: SWITCHING

Optimized for fast switching speeds and efficient performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 30 V

Can handle higher voltage levels without breakdown, suitable for various applications.

Maximum Drain Current (ID): 1.95 A

Capable of handling high current loads, making it versatile for different uses.

Maximum Power Dissipation (Abs): 0.4 W

Efficient power handling capability, ensuring stable operation under load.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for industrial environments.

Maximum Drain-Source On Resistance: 0.2 ohm

Low on-resistance leads to minimal power loss and efficient operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR4502PT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.95 A

Maximum Drain Current (ID):

1.95 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4502PT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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