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NTR4101PT1H

Onsemi

NTR4101PT1H by Onsemi

NTR4101PT1H by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, 2.4A Drain Current, and 0.085 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 1.25W at 150°C temperature.

Median Price

$0.196

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,000 parts In-Stock

1+ parts

$0.098

100+ parts

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3,000

$0.098

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DigiKey

USA . 28,324 parts In-Stock

1+ parts

$0.660

100+ parts

$0.261

1k+ parts

$0.178

10k+ parts

$0.132

28,324

$0.660

$0.261

$0.178

$0.132

Mouser Electronics

USA . 857 parts In-Stock

1+ parts

$0.660

100+ parts

$0.262

1k+ parts

$0.178

10k+ parts

$0.134

857

$0.660

$0.262

$0.178

$0.134

Newark

USA . 2,699 parts In-Stock

1+ parts

$0.707

100+ parts

$0.308

1k+ parts

$0.224

10k+ parts

-

2,699

$0.707

$0.308

$0.224

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Rochester

USA . 576,000 parts In-Stock

1+ parts

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100+ parts

$0.152

1k+ parts

$0.126

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$0.112

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$0.152

$0.126

$0.112

Verical

USA . 573,000 parts In-Stock

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$0.141

573,000

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$0.141

Flip Electronics (Authorized)

USA . 234,000 parts In-Stock

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Master Electronics

USA . 3,000 parts In-Stock

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$0.177

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$0.122

3,000

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$0.122

Farnell

UK . 2,709 parts In-Stock

1+ parts

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$0.216

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$0.168

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$0.148

2,709

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$0.216

$0.168

$0.148

Element14

Singapore . 2,704 parts In-Stock

1+ parts

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$0.370

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$0.252

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$0.247

2,704

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$0.370

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$0.247

Chip1Stop

Japan . 239 parts In-Stock

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$0.120

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239

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$0.120

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Distributors (In-Stock)

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Vyrian

USA . 1,666 parts In-Stock

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$0.115

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1,666

$0.115

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Digiode

USA . 1,999 parts In-Stock

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$0.118

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Flip Electronics

USA . 225,000 parts In-Stock

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Chip Stock

USA . 15,500 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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$0.195

6,000

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$0.195

IBS Electronics

USA . 3,000 parts In-Stock

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$0.248

10k+ parts

$0.172

3,000

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$0.248

$0.172

SPM Sales

USA . 2,855 parts In-Stock

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2,855

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LIBRA Elektronik GmbH

Germany . 500 parts In-Stock

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500

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Semi Source

USA . 34 parts In-Stock

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Elcom Components

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Distributors (Availability)

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Corphita

USA . 845 parts In-Stock

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$0.112

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845

$0.112

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Corohmni

South Africa . 370 parts In-Stock

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$0.115

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370

$0.115

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Continental Prestige Electronics

USA . 5,880 parts In-Stock

1+ parts

$0.518

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$0.265

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$0.149

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$0.140

5,880

$0.518

$0.265

$0.149

$0.140

Perfect Parts

USA . 13,475 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,250 parts In-Stock

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Infinite Electronics LLP (Excess)

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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Formix International (Excess)

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Kulean Microsystems

USA . 5,438 parts In-Stock

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Lixinc

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SupplyDigital Components

Austria . 4,473 parts In-Stock

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TANS Electronics

Latvia . 3,337 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 1,853 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Kepictronics

USA . 350 parts In-Stock

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UHIMA Technologies

Türkiye . 328 parts In-Stock

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328

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Overview

Unlock the potential of your electronic devices with the NTR4101PT1H by Onsemi. This small signal field effect transistor offers unmatched quality and reliability, thanks to Onsemi's reputation for superior manufacturing standards. Ideal for switching applications, this P-channel transistor with a built-in diode provides efficient performance and precise control. With a low on-resistance and high drain current, this enhancement mode transistor delivers exceptional value and versatility. Trust Onsemi's expertise and invest in the NTR4101PT1H for all your electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability for the small signal FET.

Polarity or Channel Type: P-CHANNEL

P-channel FETs offer low on-state resistance and high current carrying capability, making them suitable for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency and performance of the FET in switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20V ensures protection against overvoltage conditions in the circuit.

Maximum Drain Current (Abs) (ID): 2.4 A

With a high maximum drain current, this FET can handle heavy loads in the circuit.

Maximum Power Dissipation (Abs): 1.25 W

The maximum power dissipation rating of 1.25W ensures the FET can handle high-power applications without overheating.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for reliable operation in demanding environments.

Maximum Drain-Source On Resistance: 0.085 ohm

The low on-resistance of the FET reduces power losses and improves efficiency in signal switching.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR4101PT1H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2.4 A

Maximum Drain Current (ID):

1.8 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4101PT1H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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