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NTR4170NT1G

Onsemi

NTR4170NT1G by Onsemi

NTR4170NT1G by Onsemi is a N-CHANNEL FET with 30V DS breakdown voltage, 3.2A ID, and 0.055 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with built-in diode. This small outline transistor has a max power dissipation of 1.25W and can withstand temperatures up to 150°C.

Median Price

$0.119

Lifecycle Status

Suppliers In-Stock

32

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 227,043 parts In-Stock

1+ parts

$0.590

100+ parts

$0.233

1k+ parts

$0.157

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227,043

$0.590

$0.233

$0.157

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DigiKey

USA . 447 parts In-Stock

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$0.590

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$0.232

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$0.157

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447

$0.590

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Chip1Stop

Japan . 318,000 parts In-Stock

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Arrow

USA . 294,000 parts In-Stock

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Verical

USA . 294,000 parts In-Stock

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Master Electronics

USA . 75,000 parts In-Stock

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Future Electronics

Canada . 72,000 parts In-Stock

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Newark

USA . 30,000 parts In-Stock

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Flip Electronics (Authorized)

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Farnell

UK . 5,640 parts In-Stock

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Element14

Singapore . 5,640 parts In-Stock

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$0.275

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Rochester

USA . 2,595 parts In-Stock

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$0.119

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$0.099

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2,595

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$0.088

Distributors (In-Stock)

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IBS Electronics

USA . 2,502,000 parts In-Stock

1+ parts

$0.146

100+ parts

$0.133

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$0.118

2,502,000

$0.146

$0.133

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$0.118

Nova Conductors

Japan . 10 parts In-Stock

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$0.148

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$0.148

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Mobius Materials

USA . 3,490 parts In-Stock

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$0.160

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$0.120

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Digiode

USA . 1,499 parts In-Stock

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$0.390

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$0.390

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TME

Poland . 2,500 parts In-Stock

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$0.510

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$0.224

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$0.143

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$0.129

2,500

$0.510

$0.224

$0.143

$0.129

Maritex

Poland . 66 parts In-Stock

1+ parts

$0.602

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$0.146

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$0.102

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$0.078

66

$0.602

$0.146

$0.102

$0.078

Chip Stock

USA . 526,715 parts In-Stock

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NAC Semi

USA . 234,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 99,128 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 59,296 parts In-Stock

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Sensible Micro Corp

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USA . 6,000 parts In-Stock

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Bristol Electronics

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Inventory MP

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Classic Components Corporation

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Prism Electronics

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Ampacity Inc.

Singapore . 61,002 parts In-Stock

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$0.075

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Corohmni

South Africa . 446 parts In-Stock

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$0.088

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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$0.145

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$0.139

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Continental Prestige Electronics

USA . 1,524 parts In-Stock

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Argo Parts USA

USA . 822 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,120 parts In-Stock

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$0.330

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Corphita

USA . 2,288 parts In-Stock

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Perfect Parts

USA . 513,073 parts In-Stock

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ChipstoGo Electronic ltd

UK . 90,000 parts In-Stock

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RC Electronics

USA . 79,411 parts In-Stock

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BidChips

USA . 62,918 parts In-Stock

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Component Connect

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Robosynatics

Brazil . 22,781 parts In-Stock

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Lucentia Tech

USA . 22,781 parts In-Stock

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$1.512

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$1.481

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$1.481

Futuretech Components

Singapore . 20,000 parts In-Stock

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Lixinc

USA . 14,530 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

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Kulean Microsystems

USA . 4,652 parts In-Stock

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TANS Electronics

Latvia . 4,526 parts In-Stock

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Problanco Electronics

Mexico . 4,253 parts In-Stock

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iodParts Technologies Inc.

India . 3,030 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,547 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,070 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 871 parts In-Stock

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SupplyDigital Components

Austria . 859 parts In-Stock

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S.R.D Solutions

India . 500 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the NTR4170NT1G from Onsemi, a leading manufacturer known for its high-quality products. This small signal field effect transistor is perfect for switching applications, offering enhanced performance and reliability. With a maximum drain current of 3.2A and a low on-resistance of 0.055 ohm, this transistor provides unmatched efficiency and precision. Trust Onsemi to deliver innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the NTR4170NT1G and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring reliable and safe operation.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better conductivity and performance compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the transistor from reverse voltage spikes, enhancing the overall reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, offering fast turn-on and turn-off times.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving space and reducing overall costs.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this transistor can handle higher voltages without damage, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB and easy integration into designs.

Terminal Form: GULL WING

Gull wing terminals make soldering and mounting easier, ensuring a reliable connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation, providing more precise and efficient performance.

Maximum Drain Current (Abs) (ID): 3.2 A

High maximum drain current allows for handling of higher current loads, making it suitable for a variety of applications.

No. of Terminals: 3

Three terminals provide the necessary connections for proper operation and control of the transistor.

Maximum Power Dissipation (Abs): 1.25 W

With a high power dissipation rating, this transistor can handle higher power levels without overheating, ensuring reliable operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is ideal for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures good performance and reliability in a variety of applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for use in a wide range of environmental conditions.

Transistor Element Material: SILICON

Silicon offers excellent performance characteristics and reliability, making it a popular choice for transistors.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and corrosion resistance, ensuring a strong and reliable connection.

Maximum Drain-Source On Resistance: 0.055 ohm

Low drain-source on resistance helps to minimize power loss and improve efficiency in the circuit.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and easier integration into circuit designs.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR4170NT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4170NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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