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NTR4503NT1

Onsemi

NTR4503NT1 by Onsemi

NTR4503NT1 by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 1.5A Drain Current, 0.11 ohm On Resistance, and operates in ENHANCEMENT MODE. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals and can handle up to 150 °C operating temperature.

Median Price

$0.079

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$0.079

1k+ parts

$0.066

10k+ parts

$0.059

4

-

$0.079

$0.066

$0.059

Distributors (In-Stock)

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Digiode

USA . 939 parts In-Stock

1+ parts

$0.062

100+ parts

-

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939

$0.062

-

-

-

Chip Stock

USA . 150,500 parts In-Stock

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150,500

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Vyrian

USA . 4,748 parts In-Stock

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4,748

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Sinequanon

UK . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 112 parts In-Stock

1+ parts

$0.055

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-

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112

$0.055

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Corphita

USA . 823 parts In-Stock

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$0.058

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823

$0.058

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$1.143

100+ parts

$1.040

1k+ parts

$0.937

10k+ parts

-

600

$1.143

$1.040

$0.937

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AZTECH Wire

Italy . 291 parts In-Stock

1+ parts

$13.930

100+ parts

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291

$13.930

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Component Stockers USA

USA . 726 parts In-Stock

1+ parts

$99.990

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726

$99.990

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RC Electronics

USA . 10,800 parts In-Stock

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Problanco Electronics

Mexico . 8,125 parts In-Stock

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TANS Electronics

Latvia . 7,490 parts In-Stock

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Kulean Microsystems

USA . 5,447 parts In-Stock

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SupplyDigital Components

Austria . 2,077 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 967 parts In-Stock

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Kepictronics

USA . 600 parts In-Stock

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600

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Continental Prestige Electronics

USA . 4 parts In-Stock

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$0.078

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4

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$0.078

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Overview

Discover the power of the NTR4503NT1 by Onsemi, a high-quality Small Signal Field Effect Transistor designed for switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers enhanced performance and reliability. Perfect for a wide range of electronics projects, this product provides customers with superior functionality and efficiency. Trust in Onsemi's reputation for excellence and unlock the full potential of your designs with the NTR4503NT1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Offers flexibility for different circuit configurations and design options.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode within the transistor.

Transistor Application: SWITCHING

Ideal for applications that require fast switching speeds and high efficiency.

Surface Mount: YES

Enables easy and efficient mounting on circuit boards.

Minimum DS Breakdown Voltage: 30 V

Suitable for handling high voltage applications.

Package Shape: RECTANGULAR

Allows for compact and efficient placement on circuit boards.

Terminal Form: GULL WING

Facilitates easy soldering and connection to other components.

Operating Mode: ENHANCEMENT MODE

Offers enhanced performance and control over the transistor operation.

Maximum Drain Current (ID): 1.5 A

Capable of handling moderate to high current loads.

No. of Terminals: 3

Provides necessary connections for effective circuit operation.

Maximum Power Dissipation: 0.73 W

Efficiently dissipates heat to prevent overheating.

Package Style: SMALL OUTLINE

Saves space on the circuit board and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Ensures reliable and stable performance in varying operating conditions.

Maximum Operating Temperature: 150 °C

Can operate effectively in high temperature environments.

Transistor Element Material: SILICON

Provides excellent electrical properties for optimal transistor performance.

Terminal Finish: TIN LEAD

Ensures good electrical conductivity and resistance to corrosion.

Maximum Drain-Source On Resistance: 0.11 ohm

Minimizes power loss and enhances efficiency in the circuit.

Terminal Position: DUAL

Allows for flexible placement and connection options in the circuit.

Peak Reflow Temperature: 235

Can withstand high temperatures during soldering and reflow processes.

Maximum Feedback Capacitance: 25 pF

Helps in reducing signal distortion and improving overall circuit performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR4503NT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.5 A

Maximum Drain Current (ID):

1.5 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4503NT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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