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NTR4502PT3

Onsemi

NTR4502PT3 by Onsemi

NTR4502PT3 by Onsemi is a P-CHANNEL FET with 30V DS breakdown voltage, 1.95A max drain current, and 0.2 ohm max on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.4W. This small outline transistor has a peak reflow temp of 235 °C and is surface mountable.

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Vyrian

USA . 5,824 parts In-Stock

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Digiode

USA . 76 parts In-Stock

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AZTECH Wire

Italy . 486 parts In-Stock

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$16.670

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TANS Electronics

Latvia . 7,275 parts In-Stock

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Problanco Electronics

Mexico . 5,250 parts In-Stock

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SupplyDigital Components

Austria . 1,545 parts In-Stock

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UHIMA Technologies

Türkiye . 945 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 748 parts In-Stock

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Corohmni

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Overview

Upgrade your electronics with the NTR4502PT3 by Onsemi! Manufactured to the highest quality standards, this P-Channel Small Signal Field Effect Transistor (FET) is perfect for switching applications. With a built-in diode and a maximum drain current of 1.95A, this transistor offers exceptional performance and reliability. Ideal for a wide range of electronic devices, this surface-mount transistor provides enhanced functionality and efficiency. Trust Onsemi for superior technology and value in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Enhanced durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are ideal for applications where the load needs to be connected to the most positive voltage, making this transistor suitable for specific circuit requirements.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides added protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, offering optimal performance in these scenarios.

Surface Mount: YES

Suitable for surface mount technology, making it easy to integrate into various electronic devices and PCBs.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this transistor can handle higher voltages without damage, ensuring reliability in operation.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer improved control and efficiency in switching applications.

Maximum Drain Current (Abs) (ID): 1.95 A

High maximum drain current allows for power handling capabilities, suitable for various applications.

No. of Terminals: 3

Simple 3-terminal design for easy integration into circuitry.

Maximum Power Dissipation (Abs): 0.4 W

Low power dissipation ensures efficient energy usage and minimizes heat generation.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on the PCB.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in electronic circuits.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon transistors are known for their high-performance characteristics and reliability.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good electrical conductivity and solderability.

Maximum Drain-Source On Resistance: 0.2 ohm

Low drain-source on resistance allows for efficient current flow and reduced power losses.

Terminal Position: DUAL

Dual terminal position for easy and secure connection.

Peak Reflow Temperature °C: 235

Can withstand high temperatures during reflow soldering processes, ensuring proper solder connections.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR4502PT3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

1.95 A

Maximum Drain Current (ID):

1.95 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4502PT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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