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NTR4101PT1

Onsemi

NTR4101PT1 by Onsemi

NTR4101PT1 by Onsemi is a P-CHANNEL FET with 20V DS breakdown voltage, 2.3A max drain current, and 0.085 ohm max on resistance. Ideal for switching applications in small outline packages, it operates in enhancement mode at up to 150 °C, making it suitable for various electronic devices.

Median Price

$0.400

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,812 parts In-Stock

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$0.400

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Chip Stock

USA . 269,500 parts In-Stock

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Lantek

USA . 33,000 parts In-Stock

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Digiode

USA . 1,660 parts In-Stock

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Metaverse IC Inc.

Canada . 35,130 parts In-Stock

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GreenTree Electronics

Israel . 24,000 parts In-Stock

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Problanco Electronics

Mexico . 7,907 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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SupplyDigital Components

Austria . 3,982 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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Kepictronics

USA . 2,375 parts In-Stock

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TANS Electronics

Latvia . 2,301 parts In-Stock

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Kulean Microsystems

USA . 1,798 parts In-Stock

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UHIMA Technologies

Türkiye . 506 parts In-Stock

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506

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Perfect Parts

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Corphita

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Corohmni

South Africa . 167 parts In-Stock

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Overview

Upgrade your electronics with the NTR4101PT1 by Onsemi, a high-quality P-CHANNEL small signal Field Effect Transistor. Perfect for switching applications, this transistor offers reliable performance and efficient power management. With a maximum drain current of 2.3 A and a low on-resistance of 0.085 ohms, this transistor provides exceptional value for your projects. Trust the expertise of Onsemi and experience the superior quality and benefits of the NTR4101PT1 in your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides good protection and insulation for the FET, making it durable and reliable.

Polarity or Channel Type: P-CHANNEL

P-channel FETs offer better performance in certain circuit configurations and can be a preferred choice for specific applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space on the PCB, making it a convenient choice for applications that require this feature.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET is optimized for fast and efficient operation in switching circuits.

Surface Mount: YES

Surface mount capability allows for easy integration into modern PCB designs, saving space and enabling efficient manufacturing processes.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle moderate voltage levels, making it suitable for a variety of applications.

Maximum Drain Current: 2.3 A

Capable of handling a maximum drain current of 2.3A, this FET can power a range of devices and circuits.

Maximum Power Dissipation: 0.5 W

The low maximum power dissipation of 0.5W ensures efficient operation and helps prevent overheating in the circuit.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can function reliably in high-temperature environments.

Maximum Drain-Source On Resistance: 0.085 ohm

The low drain-source on resistance of 0.085 ohm ensures minimal power loss and efficient performance in the circuit.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR4101PT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2.3 A

Maximum Drain Current (ID):

1.8 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4101PT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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