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NTR4503NT3G

Onsemi

NTR4503NT3G by Onsemi

NTR4503NT3G by Onsemi is a small signal FET with N-channel polarity and single configuration. It has a min DS breakdown voltage of 30V, max drain current of 2A, and max power dissipation of 0.73W. Ideal for switching applications, this MOSFET operates in enhancement mode with a max operating temperature of 150 °C.

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4

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1k+

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USA . 616,000 parts In-Stock

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Flip Electronics

USA . 583,000 parts In-Stock

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Vyrian

USA . 3,138 parts In-Stock

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Digiode

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$0.697

100+ parts

$0.634

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$0.572

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50

$0.697

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AZTECH Wire

Italy . 742 parts In-Stock

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$11.890

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Component Stockers USA

USA . 212 parts In-Stock

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$99.990

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Kepictronics

USA . 45,000 parts In-Stock

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SupplyDigital Components

Austria . 6,988 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,146 parts In-Stock

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TANS Electronics

Latvia . 5,750 parts In-Stock

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Problanco Electronics

Mexico . 5,316 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 40 parts In-Stock

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Overview

Elevate your electronic devices with the high-quality NTR4503NT3G Small Signal Field Effect Transistor by Onsemi. This single N-channel transistor is designed for switching applications, offering reliable performance and efficiency. With a built-in diode and a maximum drain current of 2A, this FET provides a seamless operation. The durable plastic/epoxy package and gull wing terminals ensure easy installation. Whether you're working on power supplies, LED lighting, or motor control systems, the NTR4503NT3G delivers exceptional value and benefits to meet your needs. Trust Onsemi for superior technology and innovation in semiconductor components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes this transistor lightweight and durable, ideal for applications where weight and reliability are important.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy implementation of certain circuit configurations without the need for additional components, simplifying the overall design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and efficient performance, making it an excellent choice for applications that require rapid switching.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltage levels, providing a wider range of applications and increased reliability.

Maximum Drain Current (Abs) (ID): 2 A

With a maximum drain current of 2A, this transistor can handle higher current loads, making it suitable for power applications that require high current carrying capacity.

Maximum Power Dissipation (Abs): 0.73 W

The maximum power dissipation of 0.73W indicates the transistor's ability to dissipate heat efficiently, ensuring reliable operation under varying load conditions.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand higher temperatures, making it suitable for demanding industrial or automotive applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTR4503NT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

1.5 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTR4503NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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