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MCH3376-TL-E

Onsemi

MCH3376-TL-E by Onsemi

MCH3376-TL-E by Onsemi is a P-CHANNEL FET with 1.5A max drain current and 0.8W power dissipation. Ideal for applications requiring surface mount technology, such as in METAL-OXIDE SEMICONDUCTOR circuits operating up to 150 °C.

Median Price

$0.108

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,336 parts In-Stock

1+ parts

$0.108

100+ parts

$0.102

1k+ parts

$0.092

10k+ parts

-

2,336

$0.108

$0.102

$0.092

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 569 parts In-Stock

1+ parts

$0.103

100+ parts

-

1k+ parts

-

10k+ parts

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569

$0.103

-

-

-

Chip Stock

USA . 61,000 parts In-Stock

1+ parts

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61,000

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Vyrian

USA . 5,412 parts In-Stock

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5,412

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 200 parts In-Stock

1+ parts

$0.097

100+ parts

-

1k+ parts

-

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200

$0.097

-

-

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Corohmni

South Africa . 380 parts In-Stock

1+ parts

$0.108

100+ parts

-

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380

$0.108

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-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.404

100+ parts

$1.390

1k+ parts

$1.334

10k+ parts

-

500

$1.404

$1.390

$1.334

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AZTECH Wire

Italy . 927 parts In-Stock

1+ parts

$17.030

100+ parts

-

1k+ parts

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927

$17.030

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SupplyDigital Components

Austria . 7,517 parts In-Stock

1+ parts

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7,517

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TANS Electronics

Latvia . 7,372 parts In-Stock

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7,372

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Perfect Parts

USA . 6,472 parts In-Stock

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6,472

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Kulean Microsystems

USA . 6,374 parts In-Stock

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6,374

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Problanco Electronics

Mexico . 3,043 parts In-Stock

1+ parts

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3,043

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UHIMA Technologies

Türkiye . 272 parts In-Stock

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272

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Futuretech Components

Singapore . 100 parts In-Stock

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100

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Get ready to experience top-notch quality with the MCH3376-TL-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers reliable Small Signal Field Effect Transistors that are perfect for a variety of applications. This P-CHANNEL FET offers unparalleled value, providing customers with high performance and efficiency. Whether you're looking to enhance your electronic devices or improve your circuit designs, the MCH3376-TL-E is the ideal choice for all your needs. Trust Onsemi to deliver excellence with every product they create.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL transistors allow for efficient control of power flow in electronic circuits, making this product suitable for applications where low power consumption is important.

Configuration: SINGLE

The single configuration simplifies circuit design and enhances compatibility with a wide range of electronic devices, making it a versatile choice for different applications.

Surface Mount: YES

Surface mount technology enables compact and efficient PCB designs, saving space and reducing manufacturing costs, making this product ideal for smaller electronic devices.

Maximum Drain Current (Abs) (ID): 1.5 A

The high maximum drain current allows for handling higher power loads, making this transistor suitable for applications that require power amplification or switching capabilities.

Maximum Power Dissipation (Abs): 0.8 W

With a low maximum power dissipation, this transistor ensures energy efficiency and minimal heat generation, making it suitable for applications where heat management is crucial.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, providing stable operation in a variety of conditions, making this product a durable and dependable choice for electronic circuits.

Maximum Operating Temperature: 150 °C

With the capability to operate at high temperatures, this transistor can withstand demanding environments and maintain performance under stress, making it suitable for industrial and automotive applications.

Terminal Finish: TIN BISMUTH

The terminal finish of tin bismuth ensures good conductivity and corrosion resistance, enhancing the lifespan of the transistor and improving overall reliability in electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time allows for quick and efficient soldering processes during manufacturing, reducing production time and costs, making this product a cost-effective choice for mass production.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables reliable solder joints and prevents component damage during assembly, ensuring product quality and performance, making it a reliable choice for electronic manufacturing processes.

Technical Specifications

Small Signal Field Effect Transistors (FET) MCH3376-TL-E attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.5 A

Maximum Drain Current (ID):

1.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MCH3376-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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