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MCH3375

Onsemi

MCH3375 by Onsemi

MCH3375 by Onsemi is a P-CHANNEL FET with 30V DS breakdown voltage, ideal for SWITCHING applications. It features 0.8W power dissipation, 0.295 ohm RDS(on), and 1.6A max drain current. This SMALL OUTLINE transistor operates in ENHANCEMENT MODE at up to 150 °C, making it suitable for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,228 parts In-Stock

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Digiode

USA . 1,309 parts In-Stock

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1,309

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Problanco Electronics

Mexico . 7,929 parts In-Stock

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7,929

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SupplyDigital Components

Austria . 5,332 parts In-Stock

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TANS Electronics

Latvia . 3,898 parts In-Stock

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Corphita

USA . 2,465 parts In-Stock

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Kulean Microsystems

USA . 1,411 parts In-Stock

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Corohmni

South Africa . 187 parts In-Stock

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UHIMA Technologies

Türkiye . 2 parts In-Stock

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Overview

Enhance your electronic projects with the MCH3375 by Onsemi, a top-quality P-Channel small signal FET designed for switching applications. With a built-in diode and a maximum drain current of 1.6 A, this transistor offers reliable performance in a compact package. Whether you're working on DIY electronics or professional circuits, the MCH3375 provides value, efficiency, and versatility. Trust Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Elevate your designs with the MCH3375 and experience the benefits of cutting-edge transistor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

Suitable for applications that require P-channel transistors, offering flexibility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Saves space and simplifies circuit design by integrating a diode within the transistor package.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in such scenarios.

Surface Mount: YES

Ideal for automated production processes and compact PCB designs.

Minimum DS Breakdown Voltage: 30 V

Can handle higher voltages, making it suitable for a variety of electronic circuits.

Package Shape: RECTANGULAR

Allows for easy placement and mounting on the PCB.

Terminal Form: FLAT

Facilitates easy soldering and connection in the circuit.

Operating Mode: ENHANCEMENT MODE

Provides better control and efficiency in switching operations.

No. of Terminals: 3

Simple and straightforward connection setup.

Maximum Power Dissipation (Abs): 0.8 W

Can handle moderate power levels, suitable for various applications.

Package Style (Meter): SMALL OUTLINE

Compact package design, saving space on the PCB.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers good insulation properties and efficient switching characteristics.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, ensuring reliability in harsh conditions.

Transistor Element Material: SILICON

Provides good performance characteristics and reliability.

Maximum Drain Current (ID): 1.6 A

Capable of handling higher current levels in the circuit.

Maximum Drain-Source On Resistance: 0.295 ohm

Low on-resistance, ensuring minimal power loss and high efficiency.

Terminal Position: DUAL

Allows for flexible PCB layout and connection options.

Technical Specifications

Small Signal Field Effect Transistors (FET) MCH3375 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

1.6 A

Maximum Drain-Source On Resistance:

.295 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MCH3375 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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