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BSS84PL6327HTSA1

Infineon Technologies

BSS84PL6327HTSA1 by Infineon Technologies

BSS84PL6327HTSA1 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode, operating in enhancement mode. With a max drain current of 0.17A and on-resistance of 12 ohm, it offers reliable performance in small outline packages at temperatures up to 150°C.

Median Price

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Lifecycle Status

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5

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1k+

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Chip Stock

USA . 223,070 parts In-Stock

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Vyrian

USA . 10,952 parts In-Stock

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VNN

France . 2,296 parts In-Stock

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Digiode

USA . 150 parts In-Stock

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150

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Nova Conductors

Japan . 80 parts In-Stock

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80

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Corohmni

South Africa . 195 parts In-Stock

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$1.380

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Aztec Data Supply Inc.

USA . 468 parts In-Stock

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$1.693

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Modulus Dynamics

Lithuania . 14,289 parts In-Stock

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$1.921

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$1.844

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$1.767

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AZTECH Wire

Italy . 226 parts In-Stock

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$11.655

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Semicontronic

India . 1,095 parts In-Stock

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$42.050

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$40.999

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$40.788

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Ampacity Inc.

Singapore . 1,055 parts In-Stock

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$59.050

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Argo Parts USA

USA . 4,613 parts In-Stock

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Microchip USA

USA . 3,834 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the BSS84PL6327HTSA1 by Infineon Technologies. Manufactured with top-quality materials and cutting-edge technology, this P-Channel Small Signal Field Effect Transistor offers reliable switching capabilities for a wide range of applications. With its compact design and high power dissipation capacity, this transistor ensures efficient operation even in demanding conditions. Trust Infineon Technologies to deliver superior products that provide value and performance to meet your needs. Upgrade your electronics with the BSS84PL6327HTSA1 and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Polarity or Channel Type:

P-CHANNEL - This specific channel type allows for efficient switching operations in electronic circuits.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and saves space on the PCB.

Transistor Application:

SWITCHING - Ideal for applications where fast switching speeds and low power consumption are required.

Surface Mount:

YES - Easy and convenient installation onto the PCB with surface mount technology.

Minimum DS Breakdown Voltage:

60 V - Provides a high breakdown voltage for added protection against voltage spikes.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy placement and mounting on the PCB.

Terminal Form:

GULL WING - Ensures secure connections and efficient heat dissipation during operation.

Operating Mode:

ENHANCEMENT MODE - Enables precise control over the transistor's conductivity for optimal performance.

Maximum Drain Current (Abs):

0.17 A - Capable of handling high currents without overheating, ensuring reliability in demanding applications.

No. of Terminals:

3 - Simplifies circuit connections and reduces complexity in design.

Maximum Power Dissipation (Abs):

0.36 W - Withstands high power dissipation levels for reliable operation in various conditions.

Package Style (Meter):

SMALL OUTLINE - Compact design ideal for space-constrained applications.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Utilizes advanced technology for improved performance and efficiency.

Maximum Operating Temperature:

150 °C - Can operate efficiently at elevated temperatures without compromising performance.

Transistor Element Material:

SILICON - Silicon material offers excellent conductivity and reliability in electronic devices.

Terminal Finish:

MATTE TIN - Provides a durable finish for secure and stable connections.

Maximum Drain-Source On Resistance:

12 ohm - Low on-resistance ensures minimal power loss and efficient operation.

Terminal Position:

DUAL - Dual terminal position allows for flexible circuit configurations.

Maximum Feedback Capacitance (Crss):

3 pF - Low feedback capacitance for improved signal integrity and stability.

Reference Standard:

AEC-Q101 - Complies with industry standards for automotive-grade electronic components.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS84PL6327HTSA1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.17 A

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

3 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS84PL6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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