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STL3NK40

STMicroelectronics

STL3NK40 by STMicroelectronics

STL3NK40 by STMicroelectronics is a N-CHANNEL FET with 400V DS breakdown voltage. It operates in enhancement mode, has 4 terminals, and features a built-in diode. Ideal for switching applications due to low 5.5 ohm RDS(on) and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

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6,000

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Vyrian

USA . 5,521 parts In-Stock

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5,521

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Anansix

USA . 2,745 parts In-Stock

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2,745

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Digiode

USA . 1,924 parts In-Stock

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1,924

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 844 parts In-Stock

1+ parts

$1.458

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-

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$1.312

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844

$1.458

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$1.312

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Advanced Electronics

New Zealand . 28 parts In-Stock

1+ parts

$1.949

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$1.774

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$1.598

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28

$1.949

$1.774

$1.598

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MKK Technologies

India . 2,156 parts In-Stock

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$2.742

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2,156

$2.742

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DigiPath Technology Company

USA . 2,156 parts In-Stock

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$2.742

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2,156

$2.742

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Microchip USA

USA . 8,800 parts In-Stock

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$9.128

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8,800

$9.128

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AZTECH Wire

Italy . 1,092 parts In-Stock

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$12.770

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1,092

$12.770

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iodParts Technologies Inc.

India . 50,000 parts In-Stock

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Kepictronics

USA . 16,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,429 parts In-Stock

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Corphita

USA . 3,517 parts In-Stock

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3,517

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Alle Elektronik GmbH

Germany . 3,253 parts In-Stock

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3,253

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Parana Technologies

USA . 1,200 parts In-Stock

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$1.744

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1,200

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$1.744

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Overview

Upgrade your electronics with the STL3NK40 from STMicroelectronics, a leading manufacturer known for top-quality components. This N-channel field-effect transistor is perfect for switching applications, boasting a 400V breakdown voltage and low on-resistance. With a compact package body and built-in diode, this transistor offers reliable performance and efficient power management. Whether you're designing automotive systems or industrial equipment, the STL3NK40 delivers the value and benefits you need for your next project. Trust STMicroelectronics to provide cutting-edge technology that meets your demands.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower resistance compared to P-channel FETs, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for protection against reverse currents and voltage spikes, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation in such scenarios.

Minimum DS Breakdown Voltage: 400 V

High breakdown voltage ensures that the transistor can handle high voltage applications without failure.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to drive and control, making them ideal for switching applications.

No. of Terminals: 4

4 terminals allow for versatile connectivity options, enabling diverse circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package saves space on the circuit board and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high speed and low power consumption, making the transistor efficient in operation.

Transistor Element Material: SILICON

Silicon material ensures good thermal conductivity and reliability, contributing to the transistor's long-term performance.

Maximum Drain-Source On Resistance: 5.5 ohm

Low on-resistance minimizes power loss and heat generation, enhancing the efficiency of the transistor.

Terminal Position: DUAL

Dual terminal position allows for easy connection and integration into various circuit layouts.

Case Connection: DRAIN

Drain connection simplifies the circuit design and enhances the transistor's performance in switching applications.

Maximum Feedback Capacitance (Crss): 6 pF

Low feedback capacitance ensures fast switching speeds and high-frequency operation capabilities for the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) STL3NK40 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

400 V

Maximum Drain-Source On Resistance:

5.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

6 pF

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL3NK40 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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