Loading...

PMV65UN,215

NXP Semiconductors

PMV65UN,215 by NXP Semiconductors

PMV65UN,215 by NXP Semiconductors is an N-channel FET designed for switching applications. It features a max drain current of 2.2 A, a breakdown voltage of 20 V, and operates at up to 150 °C. Its compact surface mount design ensures efficient performance in electronic circuits.

Median Price

$0.166

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,063 parts In-Stock

1+ parts

-

100+ parts

$0.166

1k+ parts

$0.137

10k+ parts

$0.122

2,063

-

$0.166

$0.137

$0.122

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,048 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

10k+ parts

-

2,048

$0.072

-

-

-

Vyrian

USA . 6,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,356

-

-

-

-

Anansix

USA . 1,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,841

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,062 parts In-Stock

1+ parts

$0.068

100+ parts

-

1k+ parts

-

10k+ parts

-

2,062

$0.068

-

-

-

Microchip USA

USA . 457 parts In-Stock

1+ parts

$0.543

100+ parts

-

1k+ parts

-

10k+ parts

-

457

$0.543

-

-

-

AZTECH Wire

Italy . 1,178 parts In-Stock

1+ parts

$15.790

100+ parts

-

1k+ parts

-

10k+ parts

-

1,178

$15.790

-

-

-

UNI Independent Distributors

Spain . 8,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,130

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,873 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,873

-

-

-

-

Kepictronics

USA . 4,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,300

-

-

-

-

A-Z Elektronik GmbH

Germany . 3,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,800

-

-

-

-

Overview

Unlock unparalleled performance with the PMV65UN,215 from NXP Semiconductors. Crafted for excellence, this N-channel FET delivers reliable switching capabilities while ensuring superior thermal management and efficiency. NXP's renowned commitment to quality guarantees a product that excels in various applications, from consumer electronics to industrial automation. Elevate your designs with a component that maximizes power, minimizes space, and enhances overall system reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and thermal resistance, making the product suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better performance in terms of drive current and power efficiency compared to P-channel counterparts.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection against reverse polarity, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Optimized for switching applications, this FET is ideal for power management and signal switching in electronic circuits.

Surface Mount: YES

Surface mount design facilitates compact layouts and is compatible with automated assembly processes, reducing manufacturing costs.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20V allows for safe operation in various applications without risk of damage.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient layout designs, allowing for effective space utilization on PCBs.

Terminal Form: GULL WING

Gull wing terminals provide secure solder joints and ease of handling during placement, contributing to higher manufacturing reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer lower on-resistance and higher efficiency, making them suitable for low-voltage applications.

Maximum Drain Current (Abs) (ID): 2.2 A

With a maximum drain current of 2.2A, this FET can handle significant load currents, suitable for high-power applications.

No. of Terminals: 3

The 3-terminal design simplifies circuit integration and reduces component count for more efficient designs.

Maximum Power Dissipation (Abs): 2.17 W

A high power dissipation rating indicates the product can handle substantial power, making it suitable for demanding environments.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact design, minimizing the footprint in electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high-speed operation and low power consumption, making it a preferred choice in modern electronics.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability in extreme conditions, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon is the most widely used material in FETs, offering good performance and thermal stability for various applications.

Terminal Finish: TIN

Tin finished terminals enhance solderability and corrosion resistance, contributing to longer product life.

Maximum Drain Current (ID): 2 A

The capability to handle 2A of drain current makes this FET versatile for use in numerous circuits.

Maximum Drain-Source On Resistance: 0.076 ohm

Low on-resistance ensures minimal energy loss and heat generation, enhancing overall circuit efficiency.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting arrangements and better alignment in PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

A specified peak reflow time improves solder joint reliability, essential for high-reliability applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with high-temperature assembly processes.

Reference Standard: IEC-60134

Compliance with IEC-60134 standards ensures the product meets international quality and safety benchmarks, promoting trust and reliability.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMV65UN,215 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2.2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.076 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

IEC-60134

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMV65UN,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19