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NTTFS4C13NTWG

Onsemi

NTTFS4C13NTWG by Onsemi

NTTFS4C13NTWG by Onsemi is a N-channel FET with 30V DS breakdown voltage and 38A max drain current. Ideal for switching applications, it features a built-in diode, 0.0094 ohm RDS(on), and operates in enhancement mode. With a small outline package style and max power dissipation of 21.5W, it is suitable for high-temperature environments up to 150 °C.

Median Price

$0.310

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 136,365 parts In-Stock

1+ parts

$0.310

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$0.300

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$0.300

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136,365

$0.310

$0.300

$0.300

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Distributors (In-Stock)

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Digiode

USA . 1,803 parts In-Stock

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$0.294

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-

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1,803

$0.294

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Chip Stock

USA . 41,000 parts In-Stock

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41,000

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Vyrian

USA . 5,703 parts In-Stock

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5,703

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Distributors (Availability)

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Corphita

USA . 1,111 parts In-Stock

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$0.279

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1,111

$0.279

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Corohmni

South Africa . 349 parts In-Stock

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$0.310

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349

$0.310

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Component Stockers USA

USA . 5,574 parts In-Stock

1+ parts

$1.100

100+ parts

$1.050

1k+ parts

$1.010

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5,574

$1.100

$1.050

$1.010

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AZTECH Wire

Italy . 236 parts In-Stock

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$15.120

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236

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Kepictronics

USA . 90,034 parts In-Stock

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Perfect Parts

USA . 30,666 parts In-Stock

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Kulean Microsystems

USA . 5,891 parts In-Stock

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Problanco Electronics

Mexico . 3,026 parts In-Stock

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SupplyDigital Components

Austria . 2,011 parts In-Stock

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TANS Electronics

Latvia . 761 parts In-Stock

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UHIMA Technologies

Türkiye . 218 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the NTTFS4C13NTWG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This small signal field effect transistor (FET) is perfect for switching applications, offering enhanced performance and efficiency. With a built-in diode and a maximum power dissipation of 21.5W, this transistor provides exceptional value and benefits to customers. Upgrade your electronics with the NTTFS4C13NTWG and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Suitable for use in many common electronic circuits and applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Allows for easier circuit design and incorporation of a diode for reverse current protection.

Transistor Application: SWITCHING

Designed for efficient switching applications, making it versatile for various electronic projects.

Minimum DS Breakdown Voltage: 30 V

Provides a high breakdown voltage, enhancing the reliability and safety of the transistor.

Package Shape: SQUARE

Facilitates easy and compact mounting in circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhances control over the transistor's conductivity and switching speed.

Maximum Drain Current (Abs) (ID): 38 A

Capable of handling high current loads, making it suitable for power applications.

No. of Terminals: 5

Provides multiple connection points for versatile circuit integration.

Maximum Power Dissipation (Abs): 21.5 W

Efficiently dissipates heat generated during operation, ensuring reliable performance.

Package Style (Meter): SMALL OUTLINE

Space-saving design for compact electronic devices and circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and reliability in various electronic applications.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments, expanding its range of applications.

Transistor Element Material: SILICON

Silicon material provides good electrical properties for efficient transistor operation.

Terminal Finish: Matte Tin (Sn) - annealed

Ensures good electrical conductivity and solderability for reliable connections.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for proper soldering and reflow processes during assembly.

Peak Reflow Temperature °C: 260

Suitable temperature for soldering without damaging the transistor's components.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTTFS4C13NTWG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

7.2 A

Maximum Drain-Source On Resistance:

.0094 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4C13NTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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