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SI2392DS-T1-GE3

Vishay Intertechnology

SI2392DS-T1-GE3 by Vishay Intertechnology

SI2392DS-T1-GE3 by Vishay Intertechnology is a N-channel FET with 100V DS breakdown voltage, 3.1A max drain current, and 0.126 ohm max on resistance. Ideal for switching applications due to its single configuration with built-in diode and enhancement mode operation. Package style is small outline, surface mountable with Gull Wing terminals.

Median Price

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1k+

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Vyrian

USA . 4,567 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 1,428 parts In-Stock

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$0.050

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Modulus Dynamics

Lithuania . 800 parts In-Stock

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AZTECH Wire

Italy . 259 parts In-Stock

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Kepictronics

USA . 51,300 parts In-Stock

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Metaverse IC Inc.

Canada . 27,731 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,301 parts In-Stock

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Continental Prestige Electronics

USA . 4,079 parts In-Stock

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Argo Parts USA

USA . 2,690 parts In-Stock

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Bastille Electronics

Australia . 1,026 parts In-Stock

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Overview

Discover the unparalleled quality and performance of the Vishay Intertechnology SI2392DS-T1-GE3 Small Signal Field Effect Transistor. Perfect for switching applications, this N-channel transistor features a single configuration with a built-in diode, offering enhanced efficiency and reliability. With a maximum drain current of 3.1A and a low on-resistance of 0.126 ohm, this transistor is a game-changer in the industry. Trust in Vishay's cutting-edge technology and choose the SI2392DS-T1-GE3 for all your electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and insulation for the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics compared to P-Channel transistors, making this product suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for easier circuit design and protection against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such tasks.

Surface Mount: YES

Surface mount technology allows for easy and compact installation on PCBs, saving space and improving assembly efficiency.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this transistor can handle higher voltage loads without damage, suitable for various applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement on a PCB and efficient use of space.

Terminal Form: GULL WING

Gull-wing terminals provide strong mechanical support and secure soldering connections, ensuring reliability in operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control of the transistor's conductive state, enabling efficient switching performance.

No. of Terminals: 3

Having 3 terminals simplifies circuit design and integration, making this transistor user-friendly.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables compact device designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low power consumption, and reliability, making this transistor efficient in operation.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its stability and reliability, ensuring long-term performance of the transistor.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good conductivity and solderability for lasting and reliable connections.

Maximum Drain Current (ID): 3.1 A

With a high maximum drain current, this transistor can handle moderate to high current loads, suitable for various applications.

Maximum Drain-Source On Resistance: 0.126 ohm

Low on-resistance ensures minimal power loss and high efficiency in switching applications, making this transistor a reliable choice.

Terminal Position: DUAL

Dual terminal position allows for flexible and versatile connections in circuit design, enhancing usability and compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

30-second peak reflow time allows for efficient soldering and assembly processes, ensuring reliable connections and performance.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and bonding, improving the reliability and longevity of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) SI2392DS-T1-GE3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

3.1 A

Maximum Drain-Source On Resistance:

.126 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI2392DS-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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