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SQUARE Cellphone ICs 256

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
TRF370333IRGETG4 by Texas Instruments

TRF370333IRGETG4

Texas Instruments

TRF370333IRGETG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square package suitable for surface mounting.

S-PQCC-N24

e4

4 mm

2

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.235 mA

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

4 mm

MAX2058ETL-T by Maxim Integrated

MAX2058ETL-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N40

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MAX2058ETL by Maxim Integrated

MAX2058ETL

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N40

e0

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

6 mm

MAX9985ETX-T by Maxim Integrated

MAX9985ETX-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MAX9985ETX by Maxim Integrated

MAX9985ETX

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

e0

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

6 mm

ADF7021BCPZ-RL7 by Analog Devices

ADF7021BCPZ-RL7

Analog Devices

Analog Devices' ADF7021BCPZ-RL7 is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. Ideal for baseband circuits in telecom applications due to its compact square package shape and low profile design.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

7 mm

AD6657BBCZRL by Analog Devices

AD6657BBCZRL

Analog Devices

AD6657BBCZRL by Analog Devices is a cellphone IC with 144 terminals in a square grid array package. It operates b/w -40 to 85 °C, with a supply voltage of 1.8V for RF and baseband circuits. The low-profile, fine-pitch design makes it suitable for industrial telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD6657BBCZ by Analog Devices

AD6657BBCZ

Analog Devices

AD6657BBCZ by Analog Devices is a cellphone IC with 144 terminals in a square package. It operates b/w -40 to 85 °C and has a supply voltage of 1.8 V, suitable for RF and baseband circuits in telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

ADL5387ACPZ-WP by Analog Devices

ADL5387ACPZ-WP

Analog Devices

ADL5387ACPZ-WP by Analog Devices is a Cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply voltage, square package shape, and quad terminal position. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and bipolar technology.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

5 V

YES

BIPOLAR

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

CC1101RTKR by Texas Instruments

CC1101RTKR

Texas Instruments

CC1101RTKR by Texas Instruments is a cellphone IC with power supplies of 1.8/3.6V, operating temperature range of -40 to 85°C, and RF & baseband circuit type. Its package style is chip carrier with very thin profile, suitable for industrial telecom applications due to its nickel palladium gold terminal finish and moisture sensitivity level of 3 MSL.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

CC1101RTK by Texas Instruments

CC1101RTK

Texas Instruments

CC1101RTK by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and a package style of chip carrier. Ideal for industrial applications requiring RF communication in compact form factors.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TRF3710IRGZT by Texas Instruments

TRF3710IRGZT

Texas Instruments

TRF3710IRGZT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 5V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

ADF7020-1BCPZ-RL by Analog Devices

ADF7020-1BCPZ-RL

Analog Devices

Analog Devices' ADF7020-1BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 3V, RF and baseband circuitry, and a compact square package suitable for telecom applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

MAX4003EBL by Maxim Integrated

MAX4003EBL

Maxim Integrated

MAX4003EBL by Maxim Integrated is a CELLPHONE IC with 8 terminals in a SQUARE package. It features GRID ARRAY style, operates b/w -40 to 85°C, and has RF & BASEBAND CIRCUIT applications. The IC has a very thin profile of 0.67mm, uses TIN LEAD finish, and requires 3V supply voltage for operation.

S-PBGA-B8

e0

1.52 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.67 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.52 mm

CC1110F16RSP by Texas Instruments

CC1110F16RSP

Texas Instruments

The Texas Instruments CC1110F16RSP is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.5mm and is suitable for industrial applications.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F32RSPR by Texas Instruments

CC1110F32RSPR

Texas Instruments

The Texas Instruments CC1110F32RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit make it ideal for industrial telecom applications. With a low profile of 0.9mm and terminal pitch of 0.5mm, it offers high performance in compact designs.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F32RSP by Texas Instruments

CC1110F32RSP

Texas Instruments

CC1110F32RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F8RSPR by Texas Instruments

CC1110F8RSPR

Texas Instruments

The Texas Instruments CC1110F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit for telecom applications. Nominal voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3 make it ideal for industrial use.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F8RSP by Texas Instruments

CC1110F8RSP

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

MAX2029ETP-T by Maxim Integrated

MAX2029ETP-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.65 mm

QUAD

5 mm

MAX2029ETP by Maxim Integrated

MAX2029ETP

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

Not Qualified

.8 mm

5 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

AD6655ABCPZ-150 by Analog Devices

AD6655ABCPZ-150

Analog Devices

AD6655ABCPZ-150 by Analog Devices is a cellphone IC with 64 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8V and max current of 0.805mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and MSL level of 3 for industrial applications.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.805 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

9 mm

AD6655ABCPZ-80 by Analog Devices

AD6655ABCPZ-80

Analog Devices

AD6655ABCPZ-80 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 1.8V and low supply current of 0.42mA. Ideal for baseband circuits, this square chip carrier package is surface mountable with a terminal pitch of 0.5mm.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.42 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

9 mm

AD6655ABCPZRL7-125 by Analog Devices

AD6655ABCPZRL7-125

Analog Devices

AD6655ABCPZRL7-125 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and max current of 0.705mA. This BASEBAND CIRCUIT IC comes in a square chip carrier package with matte tin finish, suitable for industrial applications.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.705 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

9 mm

AD6655ABCPZRL7-150 by Analog Devices

AD6655ABCPZRL7-150

Analog Devices

AD6655ABCPZRL7-150 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and consumes 0.805mA current. This BASEBAND CIRCUIT IC comes in a SQUARE package style, suitable for telecom applications.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.805 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

Matte Tin (Sn)

NO LEAD

.5 mm

QUAD

30

9 mm

SI4710-B30-GMR by Silicon Labs

SI4710-B30-GMR

Silicon Labs

SI4710-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating temp range -20 to 85°C, CMOS tech, and 3.3V supply voltage make it ideal for RF and baseband circuits in telecom applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4710-B30-GM by Silicon Labs

SI4710-B30-GM

Silicon Labs

SI4710-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20 to 85°C, ideal for RF and baseband circuits. With CMOS technology and 3.3V supply voltage, it's perfect for compact telecom applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4711-B30-GMR by Silicon Labs

SI4711-B30-GMR

Silicon Labs

SI4711-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3.3V. Ideal for telecom applications due to its compact size and surface-mount capability.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4711-B30-GM by Silicon Labs

SI4711-B30-GM

Silicon Labs

SI4711-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. It features RF and baseband circuit technology, suitable for cellphone applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4712-B30-GMR by Silicon Labs

SI4712-B30-GMR

Silicon Labs

SI4712-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, utilizing CMOS technology and requiring 3.3V supply voltage. This RF and baseband circuit is ideal for compact mobile devices due to its very thin profile and small dimensions of 3mm x 3mm.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4713-B30-GMR by Silicon Labs

SI4713-B30-GMR

Silicon Labs

SI4713-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this CMOS technology IC has a compact size of 3x3mm and terminal pitch of 0.5mm.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4713-B30-GM by Silicon Labs

SI4713-B30-GM

Silicon Labs

SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SKY73420-11 by Skyworks Solutions

SKY73420-11

Skyworks Solutions

SKY73420-11 by Skyworks Solutions is a 36-terminal cellphone IC with a square package shape and 0.9mm seated height. It features RF and baseband circuit for telecom applications, operates at 5V supply voltage, and has a terminal pitch of 0.5mm. Ideal for compact devices requiring high-performance RF capabilities.

S-XQCC-N36

6 mm

1

36

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.9 mm

5 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

6 mm

ADS58C20IPFPR by Texas Instruments

ADS58C20IPFPR

Texas Instruments

Texas Instruments ADS58C20IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.

3.45 V

S-PQFP-G80

e4

12 mm

3

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

1.2 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

ADS58C20IPFP by Texas Instruments

ADS58C20IPFP

Texas Instruments

Texas Instruments ADS58C20IPFP is an 80-terminal cellphone IC with a max analog input of 3.45V, operating b/w -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.

3.45 V

S-PQFP-G80

e4

12 mm

3

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

1.2 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

ADS58C23IPFPR by Texas Instruments

ADS58C23IPFPR

Texas Instruments

Texas Instruments ADS58C23IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. Ideal for RF and baseband circuits, this IC has a compact square package style with gull wing terminals suitable for surface mount applications.

3.45 V

S-PQFP-G80

e4

12 mm

3

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

1.2 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

CC2591RGVRG4 by Texas Instruments

CC2591RGVRG4

Texas Instruments

CC2591RGVRG4 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. This RF front end circuit has a max supply current of 4mA, making it ideal for industrial telecom applications.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC2591RGVTG4 by Texas Instruments

CC2591RGVTG4

Texas Instruments

RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

ADF4360-9BCPZRL by Analog Devices

ADF4360-9BCPZRL

Analog Devices

Analog Devices' ADF4360-9BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features a square package shape, matte tin finish, and industrial temperature grade. Ideal for baseband circuits in telecom applications due to its compact size (4x4mm) and low profile (1mm).

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-9BCPZ by Analog Devices

ADF4360-9BCPZ

Analog Devices

Analog Devices' ADF4360-9BCPZ is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 3.3V and terminal pitch of 0.5mm. Ideal for baseband circuits, it features matte tin finish and very thin profile for industrial telecom applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

AD8366ACPZ-R7 by Analog Devices

AD8366ACPZ-R7

Analog Devices

AD8366ACPZ-R7 by Analog Devices is a Cellphone IC with 2 functions, operating at -40 to 85 °C. It features a square package style, 32 terminals, and matte tin finish. Ideal for telecom applications as a baseband circuit with a nominal voltage of 5V.

S-XQCC-N32

e3

5 mm

3

2

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

1 mm

5 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

MAX2306EGI by Maxim Integrated

MAX2306EGI

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

240

3/3.3

Not Qualified

.9 mm

Other Telecom ICs

.0415 mA

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

20

5 mm

MAX2902EGI by Maxim Integrated

MAX2902EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7/4.5

Not Qualified

.9 mm

Other Telecom ICs

4.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2904EGI by Maxim Integrated

MAX2904EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7/4.5

Not Qualified

.9 mm

Other Telecom ICs

4.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2361EGM by Maxim Integrated

MAX2361EGM

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N48

e0

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

Not Qualified

1 mm

Other Telecom ICs

.09 mA

2.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

7 mm

AD6634BBC by Analog Devices

AD6634BBC

Analog Devices

AD6634BBC by Analog Devices is a Cellphone IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with power supplies of 2.5-3.3V. This BASEBAND CIRCUIT technology uses CMOS and is ideal for telecom applications.

S-PBGA-B196

e0

15 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA196,14X14,40

SQUARE

GRID ARRAY

240

2.5,3.3

Not Qualified

Other Telecom ICs

2.5 V

YES

CMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

15 mm

TRF6901PTR by Texas Instruments

TRF6901PTR

Texas Instruments

TRF6901PTR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, with supply voltage of 2/3.3V and current draw of 0.04mA. Ideal for RF and baseband circuits in telecom applications due to its low profile design and fine pitch style.

S-PQFP-G48

e4

7 mm

1

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

2/3.3

Not Qualified

1.6 mm

Other Telecom ICs

.04 mA

2.7 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

7 mm

MAX2620EUA by Maxim Integrated

MAX2620EUA

Maxim Integrated

MAX2620EUA by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature range from -40 to 85°C. Telecom IC type for RF and baseband circuits, suitable for industrial applications.

S-PDSO-G8

e0

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

240

Not Qualified

1.1 mm

3 V

YES

BIPOLAR

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

20

3 mm