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SQUARE Cellphone ICs 256

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
ADRF5547BCPZN by Analog Devices

ADRF5547BCPZN

Analog Devices

Analog Devices' ADRF5547BCPZN is a 40-terminal cellphone IC with a square surface mount package. It operates b/w -40 to 105°C, ideal for industrial telecom applications. With a nominal voltage of 5V and RF front end circuit type, it offers high performance in a compact chip carrier package.

S-XQCC-N40

6 mm

3

1

40

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

5 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

30

6 mm

S2-LPTXQTR by STMicroelectronics

S2-LPTXQTR

STMicroelectronics

STMicroelectronics S2-LPTXQTR is a cellphone IC with 24 terminals in a square chip carrier package. Operating temperature ranges from -40 to 105°C. It features RF and baseband circuits, suitable for telecom applications with a nominal voltage of 3V.

S-XQCC-N24

4 mm

1

24

105 Cel

-40 Cel

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

4 mm

LX5584BLQ-TR by Microchip Technology

LX5584BLQ-TR

Microchip Technology

LX5584BLQ-TR by Microchip Technology is a Cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for cellphone applications.

S-XQCC-N16

3 mm

1

16

85 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.023 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

3 mm

AFE7920IABJ by Texas Instruments

AFE7920IABJ

Texas Instruments

AFE7920IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a terminal pitch of 0.8mm and measures 17x17mm, making it ideal for cellphone applications.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

ADRF6650ACPZ-RL7 by Analog Devices

ADRF6650ACPZ-RL7

Analog Devices

Analog Devices' ADRF6650ACPZ-RL7 is a 56-terminal cellphone IC with BICMOS technology, operating from -40 to 105 °C. It features RF and baseband circuits, suitable for telecom applications. The chip carrier package has a very thin profile, measuring 8mm x 8mm in size.

S-XQCC-N56

8 mm

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

8 mm

ADRF6650ACPZ by Analog Devices

ADRF6650ACPZ

Analog Devices

Analog Devices' ADRF6650ACPZ is a 56-terminal cellphone IC in a square chip carrier package. Operating from -40 to 105°C, it's ideal for RF and baseband circuits with a nominal voltage of 3.3V. Utilizing BiCMOS technology, this industrial-grade IC has a very thin profile at 0.8mm seated height.

S-XQCC-N56

8 mm

1

56

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

8 mm

WLAN7102CZ by NXP Semiconductors

WLAN7102CZ

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .7 mm;

S-PQCC-N16

2 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.07SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.7 mm

214 mA

3.85 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.4 mm

QUAD

2 mm

CC1260RGZR by Texas Instruments

CC1260RGZR

Texas Instruments

CC1260RGZR by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

CC1260RGZT by Texas Instruments

CC1260RGZT

Texas Instruments

CC1260RGZT by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40°C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

AFE7700IALK by Texas Instruments

AFE7700IALK

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: FBGA; Package Shape: SQUARE;

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e0

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

220

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

20

17 mm

AD9361BBCZ-CSL by Analog Devices

AD9361BBCZ-CSL

Analog Devices

AD9361BBCZ-CSL by Analog Devices is a cellphone IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, consuming max 150mA at 1.3V. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface-mount capability.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.7 mm

150 mA

1.3 V

YES

RF AND BASEBAND CIRCUIT

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

AD9986BBPZ-4D2AC by Analog Devices

AD9986BBPZ-4D2AC

Analog Devices

AD9986BBPZ-4D2AC by Analog Devices is a Cellphone IC with 324 terminals in a square package. It operates b/w -40 to 120 °C, consuming 4070mA at 1V. This RF and baseband circuit is ideal for mobile phone applications due to its compact size and high performance capabilities.

S-PBGA-B324

15 mm

3

1

324

120 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

260

1.72 mm

4070 mA

1 V

YES

RF AND BASEBAND CIRCUIT

BALL

.8 mm

BOTTOM

30

15 mm

AFE8030IABJ by Texas Instruments

AFE8030IABJ

Texas Instruments

AFE8030IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a square package. It operates b/w -40°C to 85°C, has a terminal pitch of 0.8mm, and features RF and baseband circuitry. Ideal for telecom applications requiring fine-pitch grid array packages.

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

17 mm

AFE8030EDIABJ by Texas Instruments

AFE8030EDIABJ

Texas Instruments

AFE8030EDIABJ by Texas Instruments is a cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with terminal finish of Tin Silver Copper. This RF and baseband circuit has a compact size of 17x17mm for telecom applications.

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

17 mm

AFE8030EDIALK by Texas Instruments

AFE8030EDIALK

Texas Instruments

AFE8030EDIALK by Texas Instruments is a Cellphone IC with 400 terminals in a square package. It operates b/w -40 to 85°C, with peak reflow temp of 220°C. This RF and baseband circuit is ideal for telecom applications due to its fine pitch grid array style and bottom terminal position.

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

S-PBGA-B400

e0

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

220

2.65 mm

YES

RF AND BASEBAND CIRCUIT

TIN LEAD

BALL

.8 mm

BOTTOM

17 mm

A7682E by Simcom Wireless Solutions

A7682E

Simcom Wireless Solutions

A7682E by Simcom Wireless Solutions is a Cellphone IC with 85 terminals in a square package. It operates b/w -40°C to 85°C, with a seated height of 2.4mm and nominal voltage of 3.8V. This RF and baseband circuit is ideal for mobile communication devices due to its compact size and temperature range suitability.

S-XXMA-N85

19.6 mm

1

85

85 Cel

-40 Cel

UNSPECIFIED

XMA

SQUARE

MICROELECTRONIC ASSEMBLY

2.4 mm

3.8 V

NO

RF AND BASEBAND CIRCUIT

NO LEAD

UNSPECIFIED

19.6 mm