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1517 Other Function uPs,uCs & Peripheral ICs 77

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TCI6636K2HDAAW24 by Texas Instruments

TCI6636K2HDAAW24

Texas Instruments

TCI6636K2HDAAW24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V and features a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDAAW2 by Texas Instruments

TCI6636K2HDAAW2

Texas Instruments

TCI6636K2HDAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at a supply voltage range of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style, making it suitable for high-performance computing applications. With a compact square shape measuring 40mm x 40mm, this IC is ideal for space-constrained designs requiring advanced processing capabilities.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDAAWA24 by Texas Instruments

TCI6636K2HDAAWA24

Texas Instruments

TCI6636K2HDAAWA24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at 0.95-1.05 V, has 1517 terminals in a GRID ARRAY package style, and measures 40mm x 40mm. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDAAWA2 by Texas Instruments

TCI6636K2HDAAWA2

Texas Instruments

TCI6636K2HDAAWA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0.95V to 1.05V, has 1517 terminals in a GRID ARRAY package style, and measures 40mm x 40mm. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6638K2KDAAW24 by Texas Instruments

TCI6638K2KDAAW24

Texas Instruments

TCI6638K2KDAAW24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V and has a peak reflow temperature of 245°C. This IC is ideal for applications requiring high processing power in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6638K2KDAAW2 by Texas Instruments

TCI6638K2KDAAW2

Texas Instruments

TCI6638K2KDAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V and has a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6638K2KDAAWA24 by Texas Instruments

TCI6638K2KDAAWA24

Texas Instruments

TCI6638K2KDAAWA24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w supply voltages of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style. Ideal for applications requiring high processing power in compact spaces.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6638K2KDAAWA2 by Texas Instruments

TCI6638K2KDAAWA2

Texas Instruments

TCI6638K2KDAAWA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at 0.95-1.05 V and has a peak reflow temperature of 245°C, making it suitable for high-performance computing applications. The CMOS technology and compact size of 40x40 mm make it ideal for advanced embedded systems requiring efficient processing power.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVB1517E by Xilinx

XCZU11EG-1FFVB1517E

Xilinx

XCZU11EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVB1517I by Xilinx

XCZU11EG-1FFVB1517I

Xilinx

XCZU11EG-1FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVF1517E by Xilinx

XCZU11EG-1FFVF1517E

Xilinx

XCZU11EG-1FFVF1517E by Xilinx is a CMOS microprocessor circuit with 1517 terminals. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. This grid array package is ideal for various applications requiring high-performance processing capabilities.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVF1517I by Xilinx

XCZU11EG-1FFVF1517I

Xilinx

XCZU11EG-1FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package with 1517 terminals is ideal for industrial applications requiring high-performance processing capabilities.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVB1517I by Xilinx

XCZU11EG-2FFVB1517I

Xilinx

XCZU11EG-2FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVF1517I by Xilinx

XCZU11EG-2FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-3FFVB1517E by Xilinx

XCZU11EG-3FFVB1517E

Xilinx

XCZU11EG-3FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-L1FFVF1517I by Xilinx

XCZU11EG-L1FFVF1517I

Xilinx

XCZU11EG-L1FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1517 terminals in a GRID ARRAY package style. Suitable for industrial applications, it features a supply voltage range of 0.698V to 0.742V.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-L2FFVF1517E by Xilinx

XCZU11EG-L2FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVB1517E by Xilinx

XCZU17EG-1FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-1FFVB1517I by Xilinx

XCZU17EG-1FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVB1517I by Xilinx

XCZU17EG-2FFVB1517I

Xilinx

XCZU17EG-2FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1517 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance at supply voltages ranging from 0.825V to 0.876V.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-3FFVB1517E by Xilinx

XCZU17EG-3FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU17EG-L1FFVB1517I by Xilinx

XCZU17EG-L1FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVB1517E by Xilinx

XCZU19EG-1FFVB1517E

Xilinx

XCZU19EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVB1517I by Xilinx

XCZU19EG-1FFVB1517I

Xilinx

XCZU19EG-1FFVB1517I by Xilinx is a CMOS microprocessor circuit with 1517 terminals. It operates in an industrial temperature range of -40 to 100 °C and has a max supply voltage of 0.876 V. This IC is commonly used in various applications requiring high-performance processing capabilities.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVB1517I by Xilinx

XCZU19EG-2FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-3FFVB1517E by Xilinx

XCZU19EG-3FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L1FFVB1517I by Xilinx

XCZU19EG-L1FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-L2FFVB1517E by Xilinx

XCZU19EG-L2FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7CG-1FFVF1517E by Xilinx

XCZU7CG-1FFVF1517E

Xilinx

The Xilinx XCZU7CG-1FFVF1517E is a CMOS microprocessor circuit with 1517 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. This versatile device is commonly used in various applications requiring high-performance processing capabilities.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7CG-1FFVF1517I by Xilinx

XCZU7CG-1FFVF1517I

Xilinx

The Xilinx XCZU7CG-1FFVF1517I is a CMOS microprocessor circuit with 1517 terminals. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This industrial-grade IC is ideal for applications requiring high-performance computing in harsh environments.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7CG-2FFVF1517I by Xilinx

XCZU7CG-2FFVF1517I

Xilinx

XCZU7CG-2FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1517 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance at low voltages.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7EG-1FFVF1517E by Xilinx

XCZU7EG-1FFVF1517E

Xilinx

XCZU7EG-1FFVF1517E by Xilinx is a CMOS microprocessor circuit with 1517 terminals in a grid array package. It operates b/w 0-100 °C and has supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7EG-2FFVF1517I by Xilinx

XCZU7EG-2FFVF1517I

Xilinx

XCZU7EG-2FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7EG-3FFVF1517E by Xilinx

XCZU7EG-3FFVF1517E

Xilinx

XCZU7EG-3FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, suitable for applications requiring high performance at temperatures ranging from 0 to 100 °C. Operating voltage ranges from 0.873V to 0.927V, making it ideal for various electronic systems.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7EV-1FFVF1517E by Xilinx

XCZU7EV-1FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7EV-1FFVF1517I by Xilinx

XCZU7EV-1FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7EV-2FFVF1517I by Xilinx

XCZU7EV-2FFVF1517I

Xilinx

The Xilinx XCZU7EV-2FFVF1517I is a CMOS microprocessor circuit with 1517 terminals. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This industrial-grade IC is ideal for applications requiring high-performance computing in harsh environments.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7EV-3FFVF1517E by Xilinx

XCZU7EV-3FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.927 V

.873 V

.9 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU7EV-L2FFVF1517E by Xilinx

XCZU7EV-L2FFVF1517E

Xilinx

XCZU7EV-L2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C, with supply voltage range of 0.698-0.742 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in various industries.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B1517

e1

4

1517

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVB1517E by Xilinx

XCZU11EG-2FFVB1517E

Xilinx

XCZU11EG-2FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in compact designs.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVF1517E by Xilinx

XCZU11EG-2FFVF1517E

Xilinx

XCZU11EG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, measuring 40x40 mm. Operating b/w 0-100°C, it requires a supply voltage of 0.825-0.876 V and can withstand peak reflow at 245°C for up to 30s.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU7CG-2FFVF1517E by Xilinx

XCZU7CG-2FFVF1517E

Xilinx

XCZU7CG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in surface mount designs.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU7EG-2FFVF1517E by Xilinx

XCZU7EG-2FFVF1517E

Xilinx

The Xilinx XCZU7EG-2FFVF1517E is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, with a rectangular shape and PLASTIC/EPOXY body material. Operating b/w 0 to 100 °C, it's ideal for applications requiring high performance and low power consumption.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU7EV-2FFVF1517E by Xilinx

XCZU7EV-2FFVF1517E

Xilinx

XCZU7EV-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDDAAW2 by Texas Instruments

TCI6636K2HDDAAW2

Texas Instruments

TCI6636K2HDDAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w supply voltages of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style. Ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDXAAW24 by Texas Instruments

TCI6636K2HDXAAW24

Texas Instruments

TCI6636K2HDXAAW24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at 0.95-1.05 V and has a peak reflow temperature of 245°C, making it suitable for high-performance computing applications. The PLASTIC/EPOXY material and BALL terminal form ensure reliable performance in various electronic systems.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDXAAW2 by Texas Instruments

TCI6636K2HDXAAW2

Texas Instruments

TCI6636K2HDXAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.95V to 1.05V, making it suitable for high-performance computing applications requiring advanced CMOS technology and surface mount compatibility. With a compact square shape measuring 40mm x 40mm, this IC offers efficient processing power in a small footprint design.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

TCI6636K2HDXAAWA24 by Texas Instruments

TCI6636K2HDXAAWA24

Texas Instruments

TCI6636K2HDXAAWA24 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates at a supply voltage range of 0.95V to 1.05V and has 1517 terminals in a GRID ARRAY package style, making it suitable for high-performance computing applications. With a compact square shape measuring 40mm x 40mm, this IC is ideal for space-constrained designs requiring advanced processing capabilities.

S-PBGA-B1517

e1

40 mm

4

1517

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT