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XCZU7CG-1FFVF1517E

Xilinx

XCZU7CG-1FFVF1517E by Xilinx

The Xilinx XCZU7CG-1FFVF1517E is a CMOS microprocessor circuit with 1517 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. This versatile device is commonly used in various applications requiring high-performance processing capabilities.

Median Price

$2,903.873

Lifecycle Status

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4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 550 parts In-Stock

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Vyrian

USA . 966 parts In-Stock

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Digiode

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Semicontronic

India . 994 parts In-Stock

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$8.000

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$7.800

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$7.760

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AZTECH Wire

Italy . 845 parts In-Stock

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Modulus Dynamics

Lithuania . 336 parts In-Stock

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Ampacity Inc.

Singapore . 1,363 parts In-Stock

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One Stop Electronics

USA . 1,549 parts In-Stock

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Corohmni

South Africa . 4,955 parts In-Stock

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MARBEL Systems

Belgium . 215 parts In-Stock

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$82.979

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$79.660

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Kenton Components

USA . 854 parts In-Stock

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Microchip USA

USA . 1,894 parts In-Stock

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Continental Prestige Electronics

USA . 5,817 parts In-Stock

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Argo Parts USA

USA . 1,055 parts In-Stock

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$2,903.873

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$2,874.834

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$2,845.795

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$2,816.756

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$2,903.873

$2,874.834

$2,845.795

$2,816.756

Netroflash

USA . 50 parts In-Stock

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$2,758.679

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$2,700.601

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Qasali Group International

UK . 3,303 parts In-Stock

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Supply Digital

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Vigor

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Corphita

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Overview

Discover the cutting-edge XCZU7CG-1FFVF1517E by Xilinx, a top-tier manufacturer known for superior quality and innovation. This versatile microprocessor circuit offers endless possibilities in various applications. From enhancing performance to increasing efficiency, this product delivers unparalleled value to customers seeking advanced solutions. Embrace the future of technology with the XCZU7CG-1FFVF1517E and unlock a world of opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the components inside.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly onto PCBs.

Maximum Supply Voltage: 0.876 V

Higher maximum supply voltage allows for better performance and versatility in different applications.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and makes it easier for integration into existing electronic systems.

No. of Terminals: 1517

Large number of terminals allow for more connections and functionalities in the device.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and reliability for the IC.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage helps in reducing power consumption and improving efficiency.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures the IC can withstand harsh conditions.

Minimum Operating Temperature: 0 °C

Wide range of operating temperatures allows for use in various environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/Silver/Copper terminal finish provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for soldering and connections on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature helps in preventing damage to the IC during assembly.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper soldering and reliability of connections.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type provides high processing power and flexibility for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation for the IC.

Terminal Form: BALL

Ball terminal form is commonly used in advanced IC packaging for better connections.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent performance of the IC.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates moderate sensitivity to moisture, which is common for electronic components.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7CG-1FFVF1517E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7CG-1FFVF1517E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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