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V62/03616-02XE

Texas Instruments

V62/03616-02XE by Texas Instruments

V62/03616-02XE by Texas Instruments is a 32-bit DSP with integrated cache, operating at up to 60 MHz. Ideal for military applications, it features a 24-bit address bus width and low power mode. With a max supply voltage of 5.25V and package style of flatpack, this DSP offers high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,285 parts In-Stock

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Digiode

USA . 3,184 parts In-Stock

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3,184

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Distributors (Availability)

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AZTECH Wire

Italy . 620 parts In-Stock

1+ parts

$13.218

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620

$13.218

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One Stop Electronics

USA . 1,280 parts In-Stock

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$26.000

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$26.000

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Corohmni

South Africa . 530 parts In-Stock

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$28.618

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530

$28.618

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Parana Technologies

USA . 30 parts In-Stock

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$54.221

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30

$54.221

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DigiPath Technology Company

USA . 574 parts In-Stock

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$59.705

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574

$59.705

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ChromeModa Solutions

Germany . 3,582 parts In-Stock

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$60.923

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$49.957

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3,582

$60.923

$49.957

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IDEA Electronic Components Group

UK . 1,813 parts In-Stock

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$60.923

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$57.877

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$54.831

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$60.923

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$54.831

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Corphita

USA . 3,611 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the V62/03616-02XE by Texas Instruments. This top-of-the-line Digital Signal Processor offers unparalleled performance, reliability, and efficiency in a compact package. Perfect for a wide range of applications, from telecommunications to industrial automation, this DSP is designed to meet your every need. Experience seamless operation and enhanced functionality with the V62/03616-02XE, setting new standards for quality and innovation in the industry. Elevate your projects to new heights with the ultimate solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product less prone to damage during handling and shipping.

Integrated Cache: YES

Having integrated cache allows for faster data access and processing, improving overall performance of the digital signal processor.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for versatility in power input options, making it compatible with a wider range of systems.

Address Bus Width: 24

A wider address bus allows for access to a larger memory space, enhancing the processing capabilities of the digital signal processor.

Bit Size: 32

A 32-bit architecture enables the processor to handle larger amounts of data quickly and efficiently.

Power Supplies (V): 5

The standard power supply voltage of 5V simplifies compatibility and integration with existing systems.

No. of Terminals: 144

Having a higher number of terminals allows for more connectivity options and flexibility in system design.

RAM Words: 512

A larger RAM capacity of 512 words enables the processor to store and access more data efficiently during operation.

Maximum Clock Frequency: 60 MHz

A higher clock frequency of 60 MHz allows for faster processing speeds and improved performance in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the digital signal processor energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) V62/03616-02XE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

28 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

2

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

475 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

V62/03616-02XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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