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V62/03617-01XE

Texas Instruments

V62/03617-01XE by Texas Instruments

V62/03617-01XE by Texas Instruments is a 32-bit DSP with integrated cache, 3.3V power supply, and 40MHz clock frequency. Ideal for military applications, it features a 24-bit address bus width and operates in temperatures ranging from -55 to 125°C.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,469 parts In-Stock

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6,469

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Digiode

USA . 2,081 parts In-Stock

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2,081

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Distributors (Availability)

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AZTECH Wire

Italy . 359 parts In-Stock

1+ parts

$8.814

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359

$8.814

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One Stop Electronics

USA . 913 parts In-Stock

1+ parts

$13.000

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913

$13.000

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Corohmni

South Africa . 1,910 parts In-Stock

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$37.819

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1,910

$37.819

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Parana Technologies

USA . 567 parts In-Stock

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$66.460

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567

$66.460

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DigiPath Technology Company

USA . 813 parts In-Stock

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$73.181

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$67.326

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813

$73.181

$67.326

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IDEA Electronic Components Group

UK . 1,354 parts In-Stock

1+ parts

$74.674

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$70.940

1k+ parts

$67.207

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1,354

$74.674

$70.940

$67.207

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ChromeModa Solutions

Germany . 1,032 parts In-Stock

1+ parts

$74.674

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$61.233

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1,032

$74.674

$61.233

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Corphita

USA . 3,409 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the V62/03617-01XE by Texas Instruments, a top-tier manufacturer known for delivering cutting-edge Digital Signal Processors. This versatile product is designed to meet the demands of various applications, offering integrated cache, low power mode, and a high maximum clock frequency of 40 MHz. With a robust package body material and advanced internal bus architecture, this DSP ensures seamless operation in extreme temperatures and challenging environments. Elevate your projects with the unmatched value and efficiency that the V62/03617-01XE brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is ideal for electronic components as it provides good insulation properties and is resistant to heat and chemicals.

Integrated Cache: YES

Having an integrated cache improves the overall performance and efficiency of the DSP, as it allows for faster data access and processing.

Surface Mount: YES

Surface mount technology makes the DSP easier to integrate into circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.47 V

The higher maximum supply voltage allows for flexibility in power supply options and ensures stable operation even at peak power consumption.

On Chip Data RAM Width: 32

With a wider data RAM width, the DSP can handle larger amounts of data simultaneously, making it suitable for complex signal processing tasks.

Address Bus Width: 24

Having a wider address bus allows for accessing a larger memory space, enabling the DSP to work with more data and instructions efficiently.

Package Shape: SQUARE

The square package shape is commonly used for integrated circuits and provides a good balance between space efficiency and ease of handling.

Bit Size: 32

A 32-bit architecture allows the DSP to handle and process data in larger chunks, improving performance and accuracy of computations.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with most electronic systems and simplifies circuit design.

No. of Terminals: 132

Having a sufficient number of terminals enables easy connectivity and integration of the DSP into various electronic systems and circuit configurations.

Package Style (Meter): FLATPACK, BUMPER

The flatpack style with bumper provides mechanical protection to the DSP during assembly and handling, ensuring reliability in harsh environments.

Minimum Supply Voltage: 3.13 V

Operating at a minimum supply voltage of 3.13V allows the DSP to handle power fluctuations without compromising performance and stability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the DSP can withstand elevated temperatures without thermal issues, suitable for industrial and automotive applications.

No. of External Interrupts: 4

Having multiple external interrupts allows the DSP to respond quickly to external events or inputs, enhancing real-time processing capabilities.

Minimum Operating Temperature: -55 °C

Operating at a minimum temperature of -55°C ensures reliable performance in cold environments or during temperature fluctuations.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish provides corrosion resistance and ensures reliable electrical connections for long-term use.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and soldering processes, making it easier to integrate the DSP into complex electronic systems.

Maximum Seated Height: 4.57 mm

The low seated height allows for compact design and space-saving integration of the DSP into small electronic devices and modules.

RAM Words: 2048

With a large number of RAM words, the DSP can store and access multiple data variables efficiently, enhancing processing speed and multitasking capabilities.

Width: 19.05 mm

The compact width of the DSP makes it suitable for applications where space is limited, while also providing easy mounting and integration into systems.

External Data Bus Width: 32

Having a wide external data bus width allows for fast data transfers between the DSP and external memory or peripherals, improving overall system performance.

Maximum Clock Frequency: 40 MHz

Operating at a high clock frequency of 40MHz enables rapid signal processing and data manipulation, making the DSP suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the DSP can undergo reliable soldering processes without compromising its performance or integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures the DSP can withstand the heat of soldering processes without damage or performance degradation.

Internal Bus Architecture: MULTIPLE

Having a multiple internal bus architecture allows for efficient data flow within the DSP, supporting parallel processing and multitasking capabilities.

Length: 19.05 mm

The compact length of the DSP makes it suitable for applications where space is limited, while also providing easy mounting and integration into systems.

Temperature Grade: MILITARY

Built to military-grade standards, the DSP is designed to operate reliably in extreme environments with high temperatures, vibrations, and shocks.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP is versatile and can be used for various digital signal processing tasks, making it suitable for a wide range of applications.

No. of Timers: 2

Having multiple timers allows the DSP to schedule and manage various tasks with precision, enhancing its real-time processing capabilities.

Technology: CMOS

Operating on CMOS technology ensures lower power consumption and higher noise immunity, making the DSP energy-efficient and reliable for long-term use.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering processes and provides mechanical strength to the connections, ensuring stability and reliability in operation.

Maximum Supply Current: 300 mA

The maximum supply current of 300mA indicates power efficiency and allows the DSP to operate within a specified power budget, suitable for battery-operated devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable operation and compatibility with standard power sources, simplifying the design and integration process.

ROM Programmability: MROM

MROM (Mask ROM) programmability allows secure storage of firmware and software instructions, enhancing data protection and preventing unauthorized access or modification.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm enables high-density PCB designs and compact circuit layouts, optimizing space utilization and design flexibility.

Format: FLOATING POINT

Operating in floating-point format allows the DSP to handle complex mathematical calculations with high precision and accuracy, essential for signal processing applications.

Moisture Sensitivity Level (MSL): 4

With a MSL of 4, the DSP can withstand moderate levels of humidity and prevent moisture-related damage during storage, handling, and operation.

Low Power Mode: YES

The low power mode feature allows the DSP to conserve energy when idle or during low processing requirements, extending battery life and reducing overall power consumption.

Barrel Shifter: YES

Having a barrel shifter in the DSP architecture enables efficient data manipulation and bitwise operations, improving computational speed and flexibility.

Technical Specifications

Digital Signal Processors (DSPs) V62/03617-01XE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

19.05 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Terminals:

132

No. of Timers:

2

On Chip Data RAM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP100,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2048

ROM Programmability:

MROM

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19.05 mm

Peripheral IC Type:

Trade Compliance

V62/03617-01XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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