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V62/03613-02XE

Texas Instruments

V62/03613-02XE by Texas Instruments

V62/03613-02XE by Texas Instruments is a 16-bit DSP with 132 terminals, operating at 66 MHz. Ideal for industrial applications, it features a max supply voltage of 5.25 V and operates in a temperature range from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,432 parts In-Stock

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4,432

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Vyrian

USA . 1,958 parts In-Stock

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1,958

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Distributors (Availability)

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One Stop Electronics

USA . 268 parts In-Stock

1+ parts

$8.000

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-

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268

$8.000

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AZTECH Wire

Italy . 535 parts In-Stock

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$15.668

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535

$15.668

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Parana Technologies

USA . 820 parts In-Stock

1+ parts

$27.289

100+ parts

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$34.217

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820

$27.289

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$34.217

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ChromeModa Solutions

Germany . 6,593 parts In-Stock

1+ parts

$30.662

100+ parts

$25.143

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6,593

$30.662

$25.143

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IDEA Electronic Components Group

UK . 197 parts In-Stock

1+ parts

$30.662

100+ parts

$29.129

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$27.596

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197

$30.662

$29.129

$27.596

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Corohmni

South Africa . 3,135 parts In-Stock

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$74.854

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3,135

$74.854

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Corphita

USA . 4,186 parts In-Stock

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DigiPath Technology Company

USA . 1,643 parts In-Stock

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$27.645

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1,643

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$27.645

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Kepictronics

USA . 320 parts In-Stock

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320

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Overview

Experience superior performance and reliability with the V62/03613-02XE by Texas Instruments, a cutting-edge Digital Signal Processor designed for a wide range of applications. With advanced technology and top-notch quality, this product offers unmatched value, benefits, and advantages to customers looking for efficient processing solutions. Trust in Texas Instruments' reputation as a leading manufacturer in the industry and elevate your projects with the V62/03613-02XE DSP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and thermal stability, making the DSP resistant to external factors and ensuring long-term reliability.

Maximum Supply Voltage: 5.25 V

Offers a wide operating voltage range, allowing the DSP to handle various power supply conditions without risk of damage.

Bit Size: 16

With a 16-bit architecture, this DSP can process data with higher precision, leading to improved accuracy in signal processing applications.

Maximum Clock Frequency: 66 MHz

High clock frequency enables rapid data processing, making this DSP suitable for real-time applications where speed is crucial.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP is specifically designed for signal processing tasks, ensuring optimal performance and efficiency in handling digital signals.

Technical Specifications

Digital Signal Processors (DSPs) V62/03613-02XE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SQFP132,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1056

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

225 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

V62/03613-02XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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