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V62/03610-01XE

Texas Instruments

V62/03610-01XE by Texas Instruments

V62/03610-01XE by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,917 parts In-Stock

1+ parts

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4,917

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Vyrian

USA . 3,731 parts In-Stock

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3,731

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,457 parts In-Stock

1+ parts

$14.000

100+ parts

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1,457

$14.000

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Corohmni

South Africa . 563 parts In-Stock

1+ parts

$43.880

100+ parts

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563

$43.880

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Parana Technologies

USA . 442 parts In-Stock

1+ parts

$48.226

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442

$48.226

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DigiPath Technology Company

USA . 560 parts In-Stock

1+ parts

$53.102

100+ parts

$48.854

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560

$53.102

$48.854

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ChromeModa Solutions

Germany . 2,881 parts In-Stock

1+ parts

$54.186

100+ parts

$44.433

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2,881

$54.186

$44.433

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IDEA Electronic Components Group

UK . 777 parts In-Stock

1+ parts

$54.186

100+ parts

$51.477

1k+ parts

$48.767

10k+ parts

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777

$54.186

$51.477

$48.767

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Corphita

USA . 1,369 parts In-Stock

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1,369

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Overview

Unleash the power of cutting-edge technology with the V62/03610-01XE by Texas Instruments, a top-tier manufacturer known for reliability and innovation. As a part of the Digital Signal Processors (DSPs) category, this product offers unparalleled performance and efficiency for a diverse range of applications. From integrated cache to low power mode, this DSP provides superior value and benefits to customers seeking high-quality solutions. Elevate your projects with the V62/03610-01XE and experience the advantages of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product reliable for various applications.

Integrated Cache: YES

Integrated cache improves processing speed by storing frequently accessed data, enhancing overall performance.

Maximum Supply Voltage: 1.89 V

With a relatively high maximum supply voltage, this DSP can handle power fluctuations without compromising functionality.

On Chip Data RAM Width: 32

Having a wide on-chip data RAM width allows for efficient data processing and storage, enhancing performance.

Address Bus Width: 24

A larger address bus width enables the processor to access a larger memory space, improving data handling capabilities.

Package Shape: SQUARE

The square package shape allows for easier integration into electronic systems and facilitates efficient use of space.

Bit Size: 32

A 32-bit architecture enables the processor to handle complex calculations and data operations with precision.

Power Supplies (V): 1.8,3.3

Multiple power supply options provide flexibility in operating the DSP in different environments and power conditions.

No. of Terminals: 144

Having a high number of terminals allows for a wide range of connectivity options and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options offer versatility in mounting and installation, catering to various design requirements.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures power efficiency and reliable operation even under low voltage conditions.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range makes this DSP suitable for industrial applications with harsh environmental conditions.

No. of External Interrupts: 4

Multiple external interrupts allow the processor to respond quickly to external events or signals, enhancing real-time performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in cold environments, expanding the range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent conductivity, corrosion resistance, and durability for reliable connections.

Terminal Position: QUAD

The quad terminal position provides stability and secure connections during installation and use.

ROM Words: 16777216

The large ROM words capacity allows for storing extensive software, firmware, and instructions for diverse applications.

Maximum Seated Height: 1.6 mm

The low seated height simplifies the design and layout requirements, making it easier to integrate the DSP into compact devices.

RAM Words: 34816

Having a large RAM words capacity enables efficient data processing, storage, and multitasking capabilities.

Width: 20 mm

Compact width dimensions facilitate easy placement and integration of the DSP into various electronic systems.

Boundary Scan: YES

Boundary scan feature enables testing and debugging of the DSP, ensuring reliability and efficient maintenance.

External Data Bus Width: 32

A wide external data bus width enhances data transfer speed and efficiency, improving overall system performance.

Maximum Clock Frequency: 100 MHz

High maximum clock frequency allows for fast data processing and real-time operations, suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and reliability in manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the integrity of the DSP during soldering and assembly processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow efficiency and parallel processing capabilities for improved performance.

Length: 20 mm

Compact length dimensions enable space-efficient designs and installations in various electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in a wide range of environmental conditions and applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports diverse applications and connectivity options, enhancing the product's compatibility and functionality.

No. of Timers: 2

Having multiple timers allows for precise timing control and scheduling tasks, essential for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance for efficient operation and energy efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable soldering connections during assembly, ensuring long-term functionality.

Maximum Supply Current: 80 mA

The specified maximum supply current ensures efficient power consumption and reliable operation within the rated limits.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent performance and reliable operation under normal operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling compact design and efficient use of board space.

Format: FLOATING POINT

Floating-point format enables high-precision mathematical calculations and processing, beneficial for complex algorithms and scientific applications.

Low Power Mode: YES

Low power mode option optimizes power consumption, extends battery life, and reduces overall energy usage, suitable for portable and energy-efficient devices.

Barrel Shifter: YES

Barrel shifter feature enhances data manipulation and arithmetic operations, improving computational efficiency and mathematical processing.

Technical Specifications

Digital Signal Processors (DSPs) V62/03610-01XE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

32

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

34816

ROM Words:

16777216

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

V62/03610-01XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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