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V62/04603-01XE

Texas Instruments

V62/04603-01XE by Texas Instruments

V62/04603-01XE by Texas Instruments is a 32-bit DSP with 65536 RAM words, operating at 1.3V and 3.3V. It features a grid array package style with 272 terminals in a square shape, suitable for applications requiring floating-point format processing in CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,425 parts In-Stock

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4,425

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Vyrian

USA . 2,344 parts In-Stock

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2,344

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 220 parts In-Stock

1+ parts

$15.500

100+ parts

-

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220

$15.500

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One Stop Electronics

USA . 1,517 parts In-Stock

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$18.000

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1,517

$18.000

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Parana Technologies

USA . 203 parts In-Stock

1+ parts

$71.680

100+ parts

$6,656.548

1k+ parts

$64.512

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203

$71.680

$6,656.548

$64.512

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Corohmni

South Africa . 481 parts In-Stock

1+ parts

$75.216

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481

$75.216

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DigiPath Technology Company

USA . 230 parts In-Stock

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$78.928

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230

$78.928

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IDEA Electronic Components Group

UK . 1,619 parts In-Stock

1+ parts

$80.539

100+ parts

$76.512

1k+ parts

$72.485

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1,619

$80.539

$76.512

$72.485

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ChromeModa Solutions

Germany . 849 parts In-Stock

1+ parts

$80.539

100+ parts

$66.042

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849

$80.539

$66.042

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Corphita

USA . 4,209 parts In-Stock

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4,209

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Overview

Unlock the power of digital signal processing with the V62/04603-01XE by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable and cutting-edge solutions. This DSP is perfect for a wide range of applications, from audio processing to telecommunications. With its 32-bit size, floating point format, and 65536 RAM words, this DSP offers unparalleled performance. Trust Texas Instruments to provide you with the best-in-class technology and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, this DSP is suitable for automated assembly processes, improving production efficiency.

Package Shape: SQUARE

The square package shape allows for easy placement on PCBs and efficient use of board space.

Bit Size: 32

With a 32-bit architecture, this DSP offers high processing power and performance for complex signal processing tasks.

Power Supplies (V): 1.3,3.3

Supporting multiple power supply voltages (1.3V and 3.3V) provides flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 272

The high number of terminals allows for multiple connections and interfaces, enabling versatile and expanded functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and electrical connectivity, enhancing overall reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and maintenance, making it user-friendly.

RAM Words: 65536

The large RAM capacity of 65536 words enables the storage and processing of a significant amount of data, essential for demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption, high speed operation, and reliable performance, making it an efficient choice for DSP applications.

Terminal Form: BALL

The ball terminal form provides secure electrical connections and robust mechanical support for improved durability and longevity.

Terminal Pitch: 1.27 mm

The fine terminal pitch of 1.27mm allows for compact design and high-density integration, ideal for space-constrained applications.

Format: FLOATING POINT

The floating-point format ensures high precision and accuracy in mathematical calculations, making this DSP suitable for computation-intensive tasks.

Technical Specifications

Digital Signal Processors (DSPs) V62/04603-01XE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FLOATING POINT

JESD-30 Code:

S-PBGA-B272

No. of Terminals:

272

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.3,3.3

RAM Words:

65536

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Trade Compliance

V62/04603-01XE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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