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V62/03669-01XE

Texas Instruments

V62/03669-01XE by Texas Instruments

V62/03669-01XE by Texas Instruments is a 32-bit DSP with 22-bit address bus width, operating at max clock frequency of 120.48 MHz. It features 16384 RAM words and supports low power mode, making it ideal for digital signal processing applications requiring high-speed performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,982 parts In-Stock

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4,982

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Digiode

USA . 967 parts In-Stock

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967

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 777 parts In-Stock

1+ parts

$17.811

100+ parts

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777

$17.811

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One Stop Electronics

USA . 634 parts In-Stock

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$35.000

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634

$35.000

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Corohmni

South Africa . 1,117 parts In-Stock

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$36.746

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1,117

$36.746

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Parana Technologies

USA . 1,718 parts In-Stock

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$65.589

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1,718

$65.589

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DigiPath Technology Company

USA . 2,150 parts In-Stock

1+ parts

$72.221

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$66.443

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2,150

$72.221

$66.443

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ChromeModa Solutions

Germany . 3,529 parts In-Stock

1+ parts

$73.695

100+ parts

$60.430

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3,529

$73.695

$60.430

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IDEA Electronic Components Group

UK . 588 parts In-Stock

1+ parts

$73.695

100+ parts

$70.010

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$66.326

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588

$73.695

$70.010

$66.326

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Corphita

USA . 1,400 parts In-Stock

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1,400

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Overview

Unleash the power of cutting-edge technology with the V62/03669-01XE by Texas Instruments. As a leading manufacturer in the digital signal processors (DSPs) category, Texas Instruments delivers unrivaled quality and reliability. This versatile product offers a wide range of applications, providing customers with superior performance and efficiency. From its advanced features to its innovative design, the V62/03669-01XE is the perfect solution for your digital processing needs. Experience the value and benefits of this exceptional product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 1.89 V

The low maximum supply voltage helps in reducing power consumption and heat generation, improving overall efficiency.

Address Bus Width: 22

A wider address bus allows for efficient memory addressing, enhancing the performance of the DSP.

Bit Size: 32

A 32-bit architecture provides high processing power and precision for complex signal processing tasks.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages enables compatibility with a range of systems and applications.

No. of Terminals: 352

A high number of terminals offer versatile connectivity options and integration with external components.

Maximum Seated Height: 3.5 mm

The compact seated height allows for slim and space-efficient designs in electronic devices.

RAM Words: 16384

A large RAM capacity ensures ample memory for data storage and processing, enhancing the DSP's performance.

Maximum Clock Frequency: 120.48 MHz

High clock frequency enables rapid signal processing and real-time data handling in demanding applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports a wide range of signal processing applications, making the product versatile.

Technical Specifications

Digital Signal Processors (DSPs) V62/03669-01XE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

120.48 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

Length:

35 mm

Low Power Mode:

YES

No. of Terminals:

352

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.5 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

V62/03669-01XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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