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V62/04603-03XA

Texas Instruments

V62/04603-03XA by Texas Instruments

V62/04603-03XA by Texas Instruments is a 32-bit DSP with integrated cache, operating at up to 200 MHz. With 272 terminals and boundary scan capability, it offers a wide range of applications in digital signal processing, featuring low power mode and multiple internal bus architecture for efficient performance.

Median Price

$78.574

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$68.160

1k+ parts

$60.990

10k+ parts

$57.400

6

-

$68.160

$60.990

$57.400

DigiKey

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Verical

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$88.987

1k+ parts

$80.463

10k+ parts

-

6

-

$88.987

$80.463

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,167 parts In-Stock

1+ parts

$71.944

100+ parts

-

1k+ parts

-

10k+ parts

-

2,167

$71.944

-

-

-

Vyrian

USA . 3,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,767

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,011 parts In-Stock

1+ parts

$36.434

100+ parts

$3,383.443

1k+ parts

$32.791

10k+ parts

-

1,011

$36.434

$3,383.443

$32.791

-

DigiPath Technology Company

USA . 1,877 parts In-Stock

1+ parts

$40.118

100+ parts

$36.909

1k+ parts

-

10k+ parts

-

1,877

$40.118

$36.909

-

-

ChromeModa Solutions

Germany . 3,281 parts In-Stock

1+ parts

$40.937

100+ parts

$33.568

1k+ parts

-

10k+ parts

-

3,281

$40.937

$33.568

-

-

IDEA Electronic Components Group

UK . 222 parts In-Stock

1+ parts

$40.937

100+ parts

$38.890

1k+ parts

$36.843

10k+ parts

-

222

$40.937

$38.890

$36.843

-

Corohmni

South Africa . 1,245 parts In-Stock

1+ parts

$42.790

100+ parts

-

1k+ parts

-

10k+ parts

-

1,245

$42.790

-

-

-

Corphita

USA . 3,367 parts In-Stock

1+ parts

$68.157

100+ parts

-

1k+ parts

-

10k+ parts

-

3,367

$68.157

-

-

-

Microchip USA

USA . 2,264 parts In-Stock

1+ parts

$118.060

100+ parts

$116.010

1k+ parts

$114.980

10k+ parts

$113.950

2,264

$118.060

$116.010

$114.980

$113.950

Overview

Experience top-notch performance with the V62/04603-03XA by Texas Instruments, a cutting-edge digital signal processor that delivers unparalleled speed and efficiency. Manufactured by industry leader Texas Instruments, this DSP boasts integrated cache, multiple power supplies, and a wide operating temperature range. With applications ranging from telecommunications to automotive systems, this versatile product offers customers exceptional value and reliability. Take your projects to the next level with the V62/04603-03XA and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package for the DSP, making it suitable for portable and rugged applications.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the DSP by reducing memory access times and increasing data processing speed.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32V allows for efficient power management while operating the DSP without risking damage due to overvoltage.

Address Bus Width: 22

With a wide address bus width of 22, the DSP can handle a larger memory address space, enabling it to process complex algorithms and data sets efficiently.

Package Shape: SQUARE

The square package shape provides a compact form factor, allowing for easier integration into circuit boards with limited space.

Bit Size: 32

The 32-bit architecture of the DSP allows for high precision processing and calculations, making it suitable for applications requiring accurate mathematical computations.

No. of Terminals: 272

The high number of terminals provide ample connectivity options for interfacing with external devices and peripherals, increasing the versatility of the DSP.

Power Supplies (V): 1.3, 3.3

The availability of multiple power supply voltages of 1.3V and 3.3V offers flexibility in powering the DSP, catering to different power requirements of various applications.

Minimum Supply Voltage: 1.2 V

The minimum supply voltage of 1.2V ensures reliable operation of the DSP even at lower power levels, enhancing its energy efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the DSP to function in harsh environmental conditions without risk of overheating.

No. of External Interrupts: 4

The presence of 4 external interrupts allows the DSP to respond quickly to external events or signals, improving its real-time processing capabilities.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C enables the DSP to operate reliably in extreme cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides excellent solderability and reliability, ensuring secure connections during assembly and operation.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the PCB layout and assembly process, making it easier to integrate the DSP into electronic devices.

Maximum Seated Height: 2.57 mm

The low maximum seated height of 2.57mm allows for a slim profile, making the DSP suitable for space-constrained applications.

RAM Words: 65536

The large RAM capacity of 65536 words provides ample memory for storing temporary data and variables, facilitating efficient data processing and manipulation.

Width: 27 mm

The compact width of 27mm makes the DSP suitable for applications where space-saving design is crucial.

Boundary Scan: YES

The presence of boundary scan capability enables easier testing and debugging of the DSP during manufacturing and maintenance processes.

External Data Bus Width: 32

With an external data bus width of 32, the DSP can transfer data to and from external memory or peripherals at a high speed, enhancing overall system performance.

Maximum Clock Frequency: 200 MHz

The high maximum clock frequency of 200MHz allows the DSP to execute instructions at a rapid pace, making it suitable for high-performance computing applications.

Peak Reflow Temperature °C: 220

The high peak reflow temperature of 220°C ensures reliable soldering during the manufacturing process, leading to robust and durable connections.

Internal Bus Architecture: MULTIPLE

The presence of multiple internal buses enhances data throughput and parallel processing capabilities of the DSP, enabling efficient execution of complex tasks.

Length: 27 mm

The short length of 27mm contributes to the overall compact size of the DSP, making it suitable for applications with space constraints.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with various other peripheral functionalities enhances the versatility of the DSP, allowing it to handle a wide range of tasks within a system.

No. of Timers: 2

Having 2 timers provides timing and scheduling capabilities to the DSP, enabling precise control of the execution of tasks and events within the system.

Technology: CMOS

The CMOS technology used in the DSP offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for energy-efficient and high-performance applications.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances conductivity, ensuring reliable connections between the DSP and the PCB.

Nominal Supply Voltage: 1.26 V

The nominal supply voltage of 1.26V provides a stable power source for the DSP, ensuring consistent and reliable performance under varying load conditions.

No. of DMA Channels: 16

Having 16 DMA channels allows for efficient data transfers between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27mm enables high-density mounting of the DSP on the PCB, conserving space and enhancing the overall system design.

Format: FLOATING POINT

Supporting floating-point format enhances the DSP's capability to handle complex mathematical operations with greater precision and accuracy, making it suitable for scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the DSP is suitable for reflow soldering processes, ensuring reliability and performance in humid environments.

Low Power Mode: YES

The availability of a low power mode allows the DSP to operate efficiently in power-constrained environments, prolonging battery life and reducing overall energy consumption.

Technical Specifications

Digital Signal Processors (DSPs) V62/04603-03XA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

V62/04603-03XA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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