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V62/04603-02XE

Texas Instruments

V62/04603-02XE by Texas Instruments

V62/04603-02XE by Texas Instruments is a DSP with 32-bit external data bus, 200 MHz clock frequency, and integrated cache. Ideal for applications requiring high-speed signal processing in compact spaces due to its grid array package style and low power mode.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,284 parts In-Stock

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Digiode

USA . 3,302 parts In-Stock

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3,302

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Distributors (Availability)

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AZTECH Wire

Italy . 222 parts In-Stock

1+ parts

$5.585

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222

$5.585

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One Stop Electronics

USA . 947 parts In-Stock

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$23.000

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947

$23.000

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Corohmni

South Africa . 1,182 parts In-Stock

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$30.805

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$30.805

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Parana Technologies

USA . 2,378 parts In-Stock

1+ parts

$43.673

100+ parts

$4,055.718

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$39.306

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2,378

$43.673

$4,055.718

$39.306

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DigiPath Technology Company

USA . 975 parts In-Stock

1+ parts

$48.090

100+ parts

$44.242

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975

$48.090

$44.242

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ChromeModa Solutions

Germany . 2,897 parts In-Stock

1+ parts

$49.071

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$40.238

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2,897

$49.071

$40.238

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IDEA Electronic Components Group

UK . 1,015 parts In-Stock

1+ parts

$49.071

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$46.617

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$44.164

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1,015

$49.071

$46.617

$44.164

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Corphita

USA . 3,224 parts In-Stock

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Overview

Experience the next level of performance and efficiency with the V62/04603-02XE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments' digital signal processors are known for their top-notch quality and reliability. Ideal for a variety of applications, this DSP offers integrated cache, boundary scan capabilities, and low power mode for optimized functionality. With a wide range of features and benefits, the V62/04603-02XE provides exceptional value to customers looking for high-performance solutions in a compact package. Elevate your projects with Texas Instruments' innovative technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity of the product.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.32 V

Allows for reliable operation within a safe voltage range, preventing damage to the DSP.

Address Bus Width: 22

Enables efficient memory addressing and data transfer within the system.

No. of Terminals: 272

Provides a wide range of connectivity options for external devices and components.

Maximum Clock Frequency: 200 MHz

Delivers high-speed processing capabilities for demanding applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically for digital signal processing tasks, ensuring optimized performance.

No. of DMA Channels: 16

Allows for efficient data transfer between peripherals and memory, enhancing overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) V62/04603-02XE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

Length:

27 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.57 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

V62/04603-02XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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