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V62/04603-04XA

Texas Instruments

V62/04603-04XA by Texas Instruments

V62/04603-04XA by Texas Instruments is a 32-bit DSP with integrated cache and 22-bit address bus width. It operates at up to 200 MHz, suitable for military-grade applications requiring high-speed processing in compact spaces. With low power mode and multiple internal bus architecture, it offers efficient performance in digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,512 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,512

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-

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Digiode

USA . 2,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,775

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 299 parts In-Stock

1+ parts

$13.492

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$13.492

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-

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One Stop Electronics

USA . 1,438 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

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10k+ parts

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1,438

$22.000

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Corohmni

South Africa . 216 parts In-Stock

1+ parts

$25.615

100+ parts

-

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216

$25.615

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Parana Technologies

USA . 1,439 parts In-Stock

1+ parts

$75.333

100+ parts

$6,995.827

1k+ parts

$67.800

10k+ parts

-

1,439

$75.333

$6,995.827

$67.800

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DigiPath Technology Company

USA . 2,197 parts In-Stock

1+ parts

$82.951

100+ parts

-

1k+ parts

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10k+ parts

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2,197

$82.951

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ChromeModa Solutions

Germany . 5,474 parts In-Stock

1+ parts

$84.644

100+ parts

$69.408

1k+ parts

-

10k+ parts

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5,474

$84.644

$69.408

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IDEA Electronic Components Group

UK . 914 parts In-Stock

1+ parts

$84.644

100+ parts

$80.412

1k+ parts

$76.180

10k+ parts

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914

$84.644

$80.412

$76.180

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Corphita

USA . 3,231 parts In-Stock

1+ parts

-

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3,231

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Overview

Enhance your digital signal processing capabilities with the V62/04603-04XA by Texas Instruments. Crafted with precision and expertise, this DSP offers top-tier performance and reliability for a wide range of applications. From audio processing to telecommunications, this versatile device delivers unparalleled value and efficiency. Experience seamless integration, advanced features, and cutting-edge technology with the V62/04603-04XA. Elevate your projects and unlock new possibilities with this exceptional offering from Texas Instruments.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps improve the efficiency and speed of data processing, making this product a good choice for applications requiring high performance.

Address Bus Width: 22

A wider address bus width allows for more memory addressability, which can be advantageous for applications that require access to large amounts of data.

Bit Size: 32

With a bit size of 32, this product offers efficient processing capabilities for handling complex algorithms and data operations.

Maximum Clock Frequency: 200 MHz

The high maximum clock frequency enables fast data processing speeds, making this product suitable for real-time signal processing applications.

Technology: CMOS

Being based on CMOS technology, this product offers low power consumption and high noise immunity, making it suitable for battery-powered devices and noise-sensitive environments.

Technical Specifications

Digital Signal Processors (DSPs) V62/04603-04XA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.25,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

V62/04603-04XA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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