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V62/03669-02XE

Texas Instruments

V62/03669-02XE by Texas Instruments

V62/03669-02XE by Texas Instruments is a 32-bit DSP with 22-bit address bus width, operating at up to 120.48 MHz clock frequency. It features 65536 RAM words and supports low power mode, making it ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,834 parts In-Stock

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Digiode

USA . 2,922 parts In-Stock

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2,922

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Distributors (Availability)

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AZTECH Wire

Italy . 634 parts In-Stock

1+ parts

$16.983

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634

$16.983

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One Stop Electronics

USA . 952 parts In-Stock

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$33.000

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$33.000

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Corohmni

South Africa . 2,137 parts In-Stock

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$34.755

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$34.755

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Parana Technologies

USA . 1,091 parts In-Stock

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$62.084

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1,091

$62.084

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IDEA Electronic Components Group

UK . 1,814 parts In-Stock

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$69.757

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$66.269

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$62.781

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1,814

$69.757

$66.269

$62.781

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ChromeModa Solutions

Germany . 501 parts In-Stock

1+ parts

$69.757

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$57.201

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501

$69.757

$57.201

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Corphita

USA . 4,019 parts In-Stock

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DigiPath Technology Company

USA . 157 parts In-Stock

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$62.893

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157

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$62.893

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Overview

Experience the power of cutting-edge technology with the V62/03669-02XE by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. As a leading player in the Digital Signal Processors (DSPs) category, this product offers unparalleled performance and efficiency in a compact package. Perfect for a wide range of applications, from audio processing to telecommunications, the V62/03669-02XE is the ideal choice for customers looking for high-value solutions that deliver exceptional benefits and advantages. Trust Texas Instruments to elevate your projects to the next level with this innovative and versatile DSP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 1.89 V

The relatively low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 22

A wider address bus width allows for higher memory addressing capabilities, enabling complex signal processing tasks.

Package Shape: SQUARE

The square package shape provides a uniform and compact form factor for easier integration into electronic systems.

Bit Size: 32

A 32-bit architecture offers high processing power and efficiency for handling digital signal processing tasks effectively.

Power Supplies (V): 1.9,3.3

Having multiple power supply options allows for flexibility in voltage requirements based on the application needs.

No. of Terminals: 352

A high number of terminals provide ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced durability and reliability in demanding operating conditions.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage helps in maintaining stable operation even under low power conditions.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively in cold environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and soldering processes during assembly.

RAM Words: 65536

With a large number of RAM words, the product can store and process a significant amount of data efficiently.

Width: 35 mm

A compact width dimension enables space-efficient PCB designs and system integration.

Boundary Scan: YES

Support for boundary scan testing ensures easier debugging and verification of the signal processor's functionality.

External Data Bus Width: 32

A 32-bit external data bus width allows for high-speed data transfer between the processor and external memory devices.

Maximum Clock Frequency: 120.48 MHz

A high maximum clock frequency enables fast processing speeds, crucial for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture improves data flow and communication efficiency within the processor, enhancing overall performance.

Length: 35 mm

The moderate length dimension aids in compact system designs while accommodating the necessary circuitry.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances the product's versatility and compatibility with different system components.

Technology: CMOS

Being CMOS technology based offers low power consumption and high noise immunity, ideal for signal processing applications.

Terminal Form: BALL

The ball terminal form provides reliable connections and facilitates easier soldering during assembly.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage ensures stable and efficient operation within the specified voltage range.

Terminal Pitch: 1.27 mm

A standardized terminal pitch allows for easy integration and compatibility with standard PCB layouts.

Format: FLOATING POINT

Support for floating-point format enhances the processor's capability to handle complex mathematical calculations with precision.

Low Power Mode: YES

The low power mode option helps in reducing power consumption during idle or low-load operation, increasing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) V62/03669-02XE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

120.48 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

Length:

35 mm

Low Power Mode:

YES

No. of Terminals:

352

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

3.5 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

V62/03669-02XE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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