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V62/03610-02YA

Texas Instruments

V62/03610-02YA by Texas Instruments

V62/03610-02YA by Texas Instruments is a 32-bit DSP with 24-bit address bus, operating at max 100 MHz. Ideal for military applications, it features low power mode, barrel shifter, and 32768 RAM words. Package: Ceramic-Metal-Sealed Cofired, grid array style with 144 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,900 parts In-Stock

1+ parts

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2,900

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Vyrian

USA . 2,224 parts In-Stock

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2,224

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 630 parts In-Stock

1+ parts

$12.000

100+ parts

-

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630

$12.000

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AZTECH Wire

Italy . 491 parts In-Stock

1+ parts

$14.384

100+ parts

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491

$14.384

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Parana Technologies

USA . 1,785 parts In-Stock

1+ parts

$19.924

100+ parts

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$19.873

10k+ parts

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1,785

$19.924

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$19.873

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DigiPath Technology Company

USA . 2,307 parts In-Stock

1+ parts

$21.938

100+ parts

$20.183

1k+ parts

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2,307

$21.938

$20.183

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ChromeModa Solutions

Germany . 3,528 parts In-Stock

1+ parts

$22.386

100+ parts

$18.357

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3,528

$22.386

$18.357

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IDEA Electronic Components Group

UK . 1,429 parts In-Stock

1+ parts

$22.386

100+ parts

$21.267

1k+ parts

$20.147

10k+ parts

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1,429

$22.386

$21.267

$20.147

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Corohmni

South Africa . 714 parts In-Stock

1+ parts

$35.587

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714

$35.587

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Corphita

USA . 2,763 parts In-Stock

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2,763

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Overview

Experience the cutting-edge technology of Texas Instruments with the V62/03610-02YA Digital Signal Processor. This high-quality product offers unparalleled performance and reliability in a compact package. Ideal for a variety of applications, this DSP provides customers with the value and benefits they need to stay ahead in today's competitive market. Trust in Texas Instruments to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides durability and protection for the internal components, ensuring reliable performance in various environments.

Surface Mount: YES

Being surface mountable makes installation and integration of this DSP easier and more efficient, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.89 V

The maximum supply voltage of 1.89 V allows for efficient power management and ensures stability in operation without exceeding voltage limits.

Address Bus Width: 24

Having a wider address bus width of 24 enables the DSP to handle larger memory addressing capabilities, allowing for complex algorithms and processing tasks.

Package Shape: SQUARE

The square package shape provides uniformity in layout design and makes it easier to mount the DSP in various circuit configurations.

Bit Size: 32

With a 32-bit architecture, this DSP can process data and instructions in larger chunks, leading to faster and more efficient signal processing.

Power Supplies (V): 1.8,3.3

Supporting multiple power supply voltages of 1.8V and 3.3V allows flexibility in power management and compatibility with different system requirements.

No. of Terminals: 144

Having a high number of terminals enables the DSP to interface with various external devices and components, expanding its functionality and connectivity.

Minimum Supply Voltage: 1.71 V

The minimum supply voltage of 1.71 V ensures that the DSP can operate reliably even at lower power levels, increasing energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the DSP to withstand harsh environmental conditions and ensures optimal performance even in high-temperature settings.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this DSP can function in extremely cold environments without compromising its performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB layout and soldering, making installation and assembly more convenient and efficient.

Maximum Seated Height: 2.4 mm

The maximum seated height of 2.4 mm ensures a compact form factor, making this DSP suitable for space-constrained applications or designs with height restrictions.

RAM Words: 32768

With a large RAM capacity of 32768 words, this DSP can store and process a significant amount of data efficiently, enabling complex signal processing tasks.

Width: 12 mm

The width of 12 mm provides a compact footprint for the DSP, making it suitable for applications where space is limited or where multiple components need to be densely packed.

Boundary Scan: YES

Having boundary scan capability simplifies testing and troubleshooting, ensuring easier debug and maintenance procedures during the product lifecycle.

External Data Bus Width: 32

With an external data bus width of 32, this DSP can efficiently transfer data to and from external devices, enhancing overall performance and data processing speed.

Maximum Clock Frequency: 100 MHz

Operating at a maximum clock frequency of 100 MHz allows for high-speed data processing and real-time signal handling, making this DSP suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 20

The short maximum time at peak reflow temperature of 20 seconds minimizes the risk of thermal damage during soldering and rework processes, ensuring product reliability.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235°C, this DSP can withstand high-temperature soldering processes without damage, ensuring robust assembly and solder joint integrity.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architecture enhances data throughput and allows for efficient data routing within the DSP, improving overall performance and processing speed.

Length: 12 mm

The length of 12 mm contributes to the compact size of this DSP, making it ideal for applications where space is limited or where a small form factor is desired.

Temperature Grade: MILITARY

Designed to meet military-grade temperature requirements, this DSP is rugged and reliable in extreme conditions, making it suitable for mission-critical applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

With peripheral IC types for digital signal processing and other functions, this DSP offers versatility and flexibility in handling a wide range of signal processing tasks and peripheral interfacing.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high-speed operation, making this DSP energy-efficient and suitable for battery-powered or portable devices.

Terminal Form: BALL

Having ball terminal form simplifies soldering and assembly processes, ensuring reliable connections and easy integration into PCB layouts.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V provides stable power delivery to the DSP, ensuring consistent performance and reducing the risk of voltage fluctuations.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this DSP facilitates compact PCB designs and allows for closer spacing of components, making it suitable for applications with high-density requirements.

Format: FLOATING POINT

Supporting floating-point format enhances the DSP's capability to perform complex mathematical operations with higher precision, making it ideal for applications that require advanced numerical processing.

Low Power Mode: YES

The low power mode enables the DSP to operate efficiently at reduced power levels, extending battery life in portable devices and reducing overall energy consumption.

Barrel Shifter: YES

Incorporating a barrel shifter allows for efficient and quick data manipulation and shifting operations, enhancing the DSP's ability to perform various signal processing tasks with speed and accuracy.

Technical Specifications

Digital Signal Processors (DSPs) V62/03610-02YA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CBGA-B144

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

2.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

V62/03610-02YA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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