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V62/03610-02YE

Texas Instruments

V62/03610-02YE by Texas Instruments

Texas Instruments V62/03610-02YE is a 32-bit DSP with integrated cache, operating at 100 MHz. It features a 24-bit address bus width and 32-bit external data bus width. Ideal for military applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,701 parts In-Stock

1+ parts

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2,701

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Digiode

USA . 920 parts In-Stock

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920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 556 parts In-Stock

1+ parts

$13.075

100+ parts

-

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556

$13.075

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One Stop Electronics

USA . 1,623 parts In-Stock

1+ parts

$26.000

100+ parts

-

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1,623

$26.000

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Parana Technologies

USA . 1,758 parts In-Stock

1+ parts

$68.268

100+ parts

$6,339.751

1k+ parts

$61.442

10k+ parts

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1,758

$68.268

$6,339.751

$61.442

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DigiPath Technology Company

USA . 2,207 parts In-Stock

1+ parts

$75.172

100+ parts

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2,207

$75.172

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ChromeModa Solutions

Germany . 1,484 parts In-Stock

1+ parts

$76.706

100+ parts

$62.899

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1,484

$76.706

$62.899

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IDEA Electronic Components Group

UK . 905 parts In-Stock

1+ parts

$76.706

100+ parts

$72.871

1k+ parts

$69.035

10k+ parts

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905

$76.706

$72.871

$69.035

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Corohmni

South Africa . 89 parts In-Stock

1+ parts

$84.459

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89

$84.459

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Corphita

USA . 2,973 parts In-Stock

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2,973

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Overview

Get ready to experience top-notch performance with the V62/03610-02YE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability with their Digital Signal Processors. This versatile product is perfect for a variety of applications, offering customers value and benefits like integrated cache, low power mode, and a floating-point format. Elevate your projects to the next level with the V62/03610-02YE and enjoy seamless operation and efficiency every step of the way.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the DSP, ensuring a longer lifespan and reliable performance.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency of the DSP, making it suitable for handling complex signal processing tasks.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage allows for flexibility in power input options, making the DSP compatible with a wide range of systems.

Address Bus Width: 24

The wide address bus allows the DSP to access a large memory space efficiently, enabling faster data processing and storage capabilities.

RAM Words: 32768

With a large RAM capacity, the DSP can handle and store a significant amount of data, enhancing its performance in processing intensive applications.

Maximum Clock Frequency: 100 MHz

A high maximum clock frequency enables the DSP to perform calculations and operations at a fast pace, making it suitable for real-time signal processing applications.

Technology: CMOS

The CMOS technology used in this DSP offers low power consumption and high noise immunity, enhancing its efficiency and reliability in various applications.

Technical Specifications

Digital Signal Processors (DSPs) V62/03610-02YE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CBGA-B144

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

2.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

V62/03610-02YE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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