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DSPIC33EP128GM306-H/PT

Microchip Technology

DSPIC33EP128GM306-H/PT by Microchip Technology

DSPIC33EP128GM306-H/PT by Microchip Technology is a 16-bit DSP with 60 MHz clock frequency, 8192 RAM words, and 21 timers. Ideal for digital signal processing applications, it features low power mode, floating-point format, and on-chip flash ROM programmability.

Median Price

$6.160

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$6.160

100+ parts

-

1k+ parts

-

10k+ parts

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500

$6.160

-

-

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Vyrian

USA . 7,783 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,783

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,362 parts In-Stock

1+ parts

$6.160

100+ parts

-

1k+ parts

-

10k+ parts

$6.037

5,362

$6.160

-

-

$6.037

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$6.160

100+ parts

$5.852

1k+ parts

$5.559

10k+ parts

$5.482

100

$6.160

$5.852

$5.559

$5.482

AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$17.732

100+ parts

-

1k+ parts

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10k+ parts

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709

$17.732

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Corohmni

South Africa . 55 parts In-Stock

1+ parts

$56.198

100+ parts

-

1k+ parts

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10k+ parts

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55

$56.198

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QUARKTWIN TECHNOLOGY LTD

USA . 21,891 parts In-Stock

1+ parts

-

100+ parts

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21,891

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Microchip USA

USA . 4,770 parts In-Stock

1+ parts

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4,770

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West Coast Incorporated

USA . 3,850 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,850

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Argo Parts USA

USA . 250 parts In-Stock

1+ parts

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250

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Overview

Unlock the power of cutting-edge technology with the DSPIC33EP128GM306-H/PT by Microchip Technology. As a leading manufacturer in the field of Digital Signal Processors, Microchip Technology delivers high-quality solutions that push the boundaries of innovation. Ideal for a wide range of applications, this product offers unmatched value, benefits, and advantages to customers seeking reliable performance and exceptional efficiency. Experience seamless operation and superior functionality with the DSPIC33EP128GM306-H/PT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the package lightweight and cost-effective, making it a good choice for applications where weight and cost are important factors.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making this DSP suitable for a wide range of applications.

Bit Size: 16

With a 16-bit architecture, this DSP can handle complex digital signal processing tasks with precision and accuracy, making it a good choice for high-performance applications.

Technology: CMOS

The CMOS technology used in this DSP offers low power consumption and high noise immunity, making it an energy-efficient and reliable choice for various applications.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency allows for fast processing of digital signals, making this DSP suitable for applications that require real-time processing and high-speed operation.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128GM306-H/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of Terminals:

64

No. of Timers:

21

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

DSPIC33EP128GM306-H/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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