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TNETV6435INZWTQ5

Texas Instruments

TNETV6435INZWTQ5 by Texas Instruments

TNETV6435INZWTQ5 by Texas Instruments is a DSP with 32-bit external data bus, operating temperature range of -40 to 125 °C, and low power mode. Ideal for automotive applications due to its CMOS technology, it features a grid array package style with 361 terminals and boundary scan capability.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 8,472 parts In-Stock

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Digiode

USA . 598 parts In-Stock

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AZTECH Wire

Italy . 234 parts In-Stock

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$12.100

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One Stop Electronics

USA . 363 parts In-Stock

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$28.000

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$35.566

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$32.365

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Parana Technologies

USA . 1,150 parts In-Stock

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$42.879

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DigiPath Technology Company

USA . 140 parts In-Stock

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$47.215

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$43.438

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ChromeModa Solutions

Germany . 3,832 parts In-Stock

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$48.179

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$39.507

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IDEA Electronic Components Group

UK . 1,353 parts In-Stock

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$48.179

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$43.361

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Corohmni

South Africa . 4,868 parts In-Stock

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Component Stockers USA

USA . 235 parts In-Stock

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Corphita

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Overview

Experience breakthrough performance with the TNETV6435INZWTQ5 by Texas Instruments, a top-tier manufacturer renowned for cutting-edge technology and reliability. As a leading Digital Signal Processor (DSP), this product offers unmatched versatility across a wide range of applications. Elevate your projects with its high-quality design, low power mode, and advanced internal bus architecture. Maximize efficiency and innovation in automotive-grade environments with a processor that delivers exceptional value and performance. Choose Texas Instruments for superior solutions that empower your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good durability and protection for the internal components of the DSP, making it resistant to external factors such as moisture and heat.

Surface Mount: Yes

Being surface mountable makes the DSP easy to integrate into circuit boards, saving space and allowing for efficient assembly processes.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V allows for efficient power management and helps in preventing overloading of the DSP.

Address Bus Width: 13

The 13-bit address bus width enables the DSP to access a larger memory space, improving its processing capabilities and efficiency.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, ensuring reliable connections for the DSP.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the DSP can function effectively in challenging environments without the risk of overheating.

Width: 16 mm

The compact width of 16 mm allows for easy integration into various electronic devices, making the DSP versatile and suitable for a wide range of applications.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances the data processing speed of the DSP, enabling it to handle complex algorithms and tasks efficiently.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the DSP can operate reliably in automotive applications, where temperature fluctuations are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor, combined with other functionalities, makes the DSP versatile and suitable for a wide range of signal processing tasks.

Technology: CMOS

The CMOS technology used in the DSP results in low power consumption, making it energy-efficient and suitable for battery-powered devices.

Low Power Mode: Yes

The availability of a low power mode allows the DSP to conserve energy when not operating at full capacity, promoting energy efficiency and prolonging battery life.

Technical Specifications

Digital Signal Processors (DSPs) TNETV6435INZWTQ5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

EMIF ADDRESS BUS 22 AND DATA BUS 8 AVAILABLE

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV6435INZWTQ5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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