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TNETV2685ZUT9

Texas Instruments

TNETV2685ZUT9 by Texas Instruments

TNETV2685ZUT9 by Texas Instruments is a DSP with 32-bit external data bus, 900 MHz clock frequency, and 14-bit address bus width. Ideal for applications requiring high-speed signal processing in digital communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,121 parts In-Stock

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4,121

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Digiode

USA . 1,518 parts In-Stock

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1,518

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Distributors (Availability)

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One Stop Electronics

USA . 472 parts In-Stock

1+ parts

$12.000

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-

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472

$12.000

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AZTECH Wire

Italy . 868 parts In-Stock

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$15.316

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868

$15.316

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Parana Technologies

USA . 2,060 parts In-Stock

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$16.354

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$16.652

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2,060

$16.354

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$16.652

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DigiPath Technology Company

USA . 912 parts In-Stock

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$18.008

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912

$18.008

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ChromeModa Solutions

Germany . 2,632 parts In-Stock

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$18.375

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$15.068

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2,632

$18.375

$15.068

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IDEA Electronic Components Group

UK . 2,234 parts In-Stock

1+ parts

$18.375

100+ parts

$17.456

1k+ parts

$16.538

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2,234

$18.375

$17.456

$16.538

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Corohmni

South Africa . 2,165 parts In-Stock

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$58.192

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$58.192

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Corphita

USA . 3,148 parts In-Stock

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Microchip USA

USA . 109 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TNETV2685ZUT9 by Texas Instruments. As a leader in digital signal processors, Texas Instruments brings unparalleled quality and reliability to the table. This versatile product is perfect for a wide range of applications, delivering high performance and efficiency. Experience seamless operation and top-notch results with this innovative solution. Upgrade your system today and discover the value and benefits that the TNETV2685ZUT9 can offer to you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and heat resistance, making this DSP suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, reducing production time and costs.

Maximum Supply Voltage: 1.26 V

This voltage level ensures safe operation of the DSP without risking damage due to excessive voltage input.

Address Bus Width: 14

A wider address bus allows for more memory address locations to be accessed, enhancing the processing capabilities of the DSP.

Package Shape: SQUARE

Square packages are typically easier to handle and store, making the DSP more user-friendly during installation and maintenance.

No. of Terminals: 520

Having a large number of terminals enables the DSP to interface with a wide range of external devices and components, increasing its versatility.

Minimum Supply Voltage: 1.14 V

This lower limit ensures that the DSP can operate efficiently even with lower power supply levels, making it suitable for battery-powered applications.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the DSP to function reliably in various environments, including industrial settings where heat can be a concern.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the DSP can still operate effectively even in colder conditions, providing flexibility in deployment.

Terminal Finish: TIN SILVER COPPER

This type of terminal finish provides good conductivity and corrosion resistance, extending the lifespan and performance of the DSP.

Terminal Position: BOTTOM

Bottom terminal position allows for easier and more efficient PCB layout and soldering during assembly, improving the overall manufacturing process.

Maximum Seated Height: 3.3 mm

The compact seated height of the DSP maximizes space efficiency on the PCB, especially in devices with strict size constraints.

Width: 19 mm

A moderate width makes the DSP suitable for various board layouts and configurations, offering flexibility in design and integration.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production, ensuring high quality and reliability in the final product.

External Data Bus Width: 32

A wide external data bus allows for faster data transfer and processing, enhancing the overall performance of the DSP in handling complex algorithms and tasks.

Maximum Clock Frequency: 900 MHz

A high clock frequency enables the DSP to operate at high speeds, making it suitable for real-time signal processing and demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering of the DSP onto the PCB, maintaining electrical connections and reliability in harsh operating conditions.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance indicates the robustness of the DSP during manufacturing processes, guaranteeing quality and consistency.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data routing and processing within the DSP, optimizing performance and throughput.

Length: 19 mm

The moderate length of the DSP ensures compatibility with standard board sizes and layouts, facilitating easy integration into various electronic systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This versatile peripheral IC type indicates that the DSP can support a wide range of external devices and peripherals, expanding its functionality and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in different operating conditions.

Terminal Form: BALL

Ball terminal form provides reliable connections and ease of soldering, enhancing the overall durability and performance of the DSP.

Nominal Supply Voltage: 1.2 V

The specified nominal supply voltage ensures stable and consistent operation of the DSP within the recommended voltage range, optimizing performance and reliability.

Terminal Pitch: 0.8 mm

A fine terminal pitch allows for high-density mounting on the PCB, saving space and enabling compact and efficient design of electronic devices.

Format: FIXED POINT

Fixed-point format simplifies signal processing algorithms and calculations, reducing complexity and enhancing the efficiency of the DSP in handling various data types and operations.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the DSP has moderate moisture sensitivity during storage and handling, requiring standard precautions to prevent damage and ensure reliability.

Low Power Mode: YES

The availability of a low power mode allows the DSP to operate in energy-efficient states when performance requirements are lower, extending battery life and reducing power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2685ZUT9 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

900 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B520

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

520

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TNETV2685ZUT9 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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