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TNETV2667FIDZWT

Texas Instruments

TNETV2667FIDZWT by Texas Instruments

TNETV2667FIDZWT by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating at max 30 MHz. Ideal for digital signal processing applications, it features low power mode, CMOS technology, and boundary scan capability. Package style: grid array, low profile, fine pitch; terminal finish: tin silver copper.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,827 parts In-Stock

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8,827

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Digiode

USA . 4,405 parts In-Stock

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4,405

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Distributors (Availability)

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AZTECH Wire

Italy . 401 parts In-Stock

1+ parts

$8.526

100+ parts

-

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401

$8.526

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One Stop Electronics

USA . 1,328 parts In-Stock

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$18.000

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1,328

$18.000

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Parana Technologies

USA . 632 parts In-Stock

1+ parts

$18.662

100+ parts

$1,733.088

1k+ parts

$16.796

10k+ parts

-

632

$18.662

$1,733.088

$16.796

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DigiPath Technology Company

USA . 426 parts In-Stock

1+ parts

$20.550

100+ parts

$18.906

1k+ parts

-

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426

$20.550

$18.906

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ChromeModa Solutions

Germany . 5,920 parts In-Stock

1+ parts

$20.969

100+ parts

$17.195

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5,920

$20.969

$17.195

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IDEA Electronic Components Group

UK . 1,327 parts In-Stock

1+ parts

$20.969

100+ parts

$19.921

1k+ parts

$18.872

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1,327

$20.969

$19.921

$18.872

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Corohmni

South Africa . 3,146 parts In-Stock

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$40.830

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3,146

$40.830

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QUARKTWIN TECHNOLOGY LTD

USA . 26,725 parts In-Stock

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26,725

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Corphita

USA . 3,837 parts In-Stock

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3,837

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Overview

Experience the power of cutting-edge technology with the TNETV2667FIDZWT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) like no other. This versatile product is designed for a wide range of applications, providing unparalleled performance and efficiency. With a focus on value and innovation, the TNETV2667FIDZWT offers customers the benefits of advanced features, reliability, and superior functionality. Upgrade your projects with confidence and unlock endless possibilities with this exceptional DSP from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a safe voltage range, ensuring reliable performance.

Address Bus Width: 13

Having a wider address bus allows for greater memory addressing capabilities and processing of larger data sets.

Package Shape: SQUARE

Square package shape helps in efficient PCB layout and space utilization.

No. of Terminals: 361

Higher number of terminals provide more connectivity options and flexibility in circuit design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Maximum Clock Frequency: 30 MHz

Capable of high clock speeds for fast signal processing and data handling.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed for digital signal processing tasks, making it a suitable choice for applications requiring signal processing capabilities.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2667FIDZWT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2667FIDZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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