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TNETV2667FIBZWT

Texas Instruments

TNETV2667FIBZWT by Texas Instruments

TNETV2667FIBZWT by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating at max 30 MHz. Ideal for digital signal processing applications, it features low power mode, CMOS technology, and boundary scan capability. Package style: Grid Array, low profile, fine pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Sense

UK . 11,389 parts In-Stock

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Vyrian

USA . 5,489 parts In-Stock

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5,489

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Digiode

USA . 1,346 parts In-Stock

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1,346

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 327 parts In-Stock

1+ parts

$2.000

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327

$2.000

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AZTECH Wire

Italy . 618 parts In-Stock

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$15.458

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618

$15.458

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Parana Technologies

USA . 1,744 parts In-Stock

1+ parts

$42.825

100+ parts

$3,976.953

1k+ parts

$38.543

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1,744

$42.825

$3,976.953

$38.543

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DigiPath Technology Company

USA . 1,655 parts In-Stock

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$47.156

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1,655

$47.156

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ChromeModa Solutions

Germany . 6,067 parts In-Stock

1+ parts

$48.118

100+ parts

$39.457

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6,067

$48.118

$39.457

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IDEA Electronic Components Group

UK . 1,423 parts In-Stock

1+ parts

$48.118

100+ parts

$45.712

1k+ parts

$43.306

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1,423

$48.118

$45.712

$43.306

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Corohmni

South Africa . 4,993 parts In-Stock

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$62.407

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4,993

$62.407

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Component Stockers USA

USA . 128 parts In-Stock

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$578.490

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128

$578.490

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QUARKTWIN TECHNOLOGY LTD

USA . 18,692 parts In-Stock

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Corphita

USA . 82 parts In-Stock

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82

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Overview

Unlock the power of cutting-edge technology with the TNETV2667FIBZWT by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This digital signal processor is perfect for a wide range of applications, offering unparalleled performance and efficiency. With a focus on innovation and customer satisfaction, this product provides exceptional value and benefits to users looking to elevate their projects to the next level. Experience the difference with Texas Instruments and see the incredible advantages this DSP can bring to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mounting allows for easier and more efficient installation on circuit boards.

Maximum Supply Voltage: 1.26 V

Provides a higher supply voltage for better performance and efficiency.

Address Bus Width: 13

Wide address bus width enables efficient data processing and transfer.

Package Shape: SQUARE

Square package shape allows for easy integration and space-efficient design in electronic devices.

No. of Terminals: 361

The high number of terminals provides connectivity options and flexibility in circuit design.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density, low profile, and fine pitch for compact and efficient placement on a PCB.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage helps in saving power and reducing energy consumption.

Maximum Operating Temperature: 90 °C

Higher maximum operating temperature ensures better reliability and performance in various environments.

Minimum Operating Temperature: 0 °C

Lower minimum operating temperature ensures the product can function in a wide range of conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish with tin, silver, and copper provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for efficient heat dissipation and component placement on PCB.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables a slim profile and space-saving design in electronic devices.

Width: 16 mm

Compact width allows for easy integration into various electronic devices.

Boundary Scan: YES

Boundary scan capability helps in debugging and testing of the product during manufacturing.

External Data Bus Width: 32

Wide external data bus width allows for faster data transfer and processing capabilities.

Maximum Clock Frequency: 30 MHz

High maximum clock frequency for efficient signal processing and data throughput.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and component mounting.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints and proper PCB assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture provides enhanced data processing capabilities.

Length: 16 mm

Compact length for space-efficient placement on a PCB.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Peripheral IC type ensures compatibility with various digital signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for efficient performance.

Terminal Form: BALL

Ball terminal form provides reliable connectivity and solder joints.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent performance and power efficiency.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting and space-saving design.

Format: FIXED POINT

Fixed-point format for accurate and efficient numerical calculations in digital signal processing.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product can withstand moderate exposure to moisture during handling and storage.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2667FIBZWT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2667FIBZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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