Loading...

SN74172N1

Texas Instruments

SN74172N1 by Texas Instruments

SN74172N1 by Texas Instruments is an 8x2 standard SRAM with 3-state output, operating in asynchronous mode. It features a rectangular plastic/epoxy package with 24 terminals and operates at temperatures ranging from 0 to 70°C. Ideal for parallel memory applications due to its TTL technology and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,147

-

-

-

-

Vyrian

USA . 4,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,136

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,645 parts In-Stock

1+ parts

$2.431

100+ parts

-

1k+ parts

$2.928

10k+ parts

-

1,645

$2.431

-

$2.928

-

ChromeModa Solutions

Germany . 3,301 parts In-Stock

1+ parts

$2.731

100+ parts

$2.239

1k+ parts

-

10k+ parts

-

3,301

$2.731

$2.239

-

-

IDEA Electronic Components Group

UK . 61 parts In-Stock

1+ parts

$2.731

100+ parts

-

1k+ parts

$2.458

10k+ parts

-

61

$2.731

-

$2.458

-

AZTECH Wire

Italy . 830 parts In-Stock

1+ parts

$12.058

100+ parts

-

1k+ parts

-

10k+ parts

-

830

$12.058

-

-

-

One Stop Electronics

USA . 733 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

-

10k+ parts

-

733

$25.000

-

-

-

Corphita

USA . 3,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,856

-

-

-

-

DigiPath Technology Company

USA . 275 parts In-Stock

1+ parts

-

100+ parts

$2.462

1k+ parts

-

10k+ parts

-

275

-

$2.462

-

-

Overview

Unlock the power of seamless data storage and retrieval with the SN74172N1 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-quality products like this SRAM chip, offering unmatched reliability and performance. Perfect for a wide range of applications, this chip provides fast and efficient data processing, making it an essential component for any electronic project. Trust in Texas Instruments and experience the value and benefits that the SN74172N1 brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the SRAM, making it suitable for a variety of applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent access to each word of memory, providing flexibility and efficient data retrieval.

No. of Terminals: 24

Having 24 terminals allows for a greater amount of data to be stored and accessed efficiently.

Output Characteristics: 3-STATE

The 3-STATE output allows for the SRAM to have high impedance when disabled, reducing power consumption and enhancing functionality.

Technology: TTL

TTL technology ensures high-speed performance and reliable operation in various environments.

Technical Specifications

SRAM SN74172N1 attributes and parameters. Explore more SRAM devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

Memory IC Type:

Memory Width:

2

No. of Terminals:

24

No. of Words:

8 words

No. of Words Code:

8

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8X2

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Sub-Category:

SRAMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74172N1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20