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SN7481AJ

Texas Instruments

SN7481AJ by Texas Instruments

The Texas Instruments SN7481AJ is a 16x1 standard SRAM with TTL technology. It operates asynchronously in commercial temperature grades from 0 to 70°C. Featuring open-collector output characteristics, it is ideal for parallel applications requiring reliable memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,804

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-

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Digiode

USA . 2,878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,878

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,040 parts In-Stock

1+ parts

$2.217

100+ parts

-

1k+ parts

$2.723

10k+ parts

-

2,040

$2.217

-

$2.723

-

DigiPath Technology Company

USA . 2,089 parts In-Stock

1+ parts

$2.441

100+ parts

$2.246

1k+ parts

-

10k+ parts

-

2,089

$2.441

$2.246

-

-

ChromeModa Solutions

Germany . 4,296 parts In-Stock

1+ parts

$2.491

100+ parts

$2.043

1k+ parts

-

10k+ parts

-

4,296

$2.491

$2.043

-

-

IDEA Electronic Components Group

UK . 1,418 parts In-Stock

1+ parts

$2.491

100+ parts

-

1k+ parts

$2.242

10k+ parts

-

1,418

$2.491

-

$2.242

-

One Stop Electronics

USA . 1,222 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,222

$14.000

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-

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AZTECH Wire

Italy . 255 parts In-Stock

1+ parts

$16.050

100+ parts

-

1k+ parts

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10k+ parts

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255

$16.050

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-

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Corphita

USA . 158 parts In-Stock

1+ parts

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158

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Kepictronics

USA . 154 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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154

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Overview

Enhance your electronic designs with the SN7481AJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This Standard SRAM device offers seamless operation in various applications, providing customers with unparalleled value and benefits. Upgrade your projects with the SN7481AJ for efficient performance and enhanced productivity.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and reliable material, making the product resistant to high temperatures and mechanical stress.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and efficient data transfer without the need for a clock signal, improving overall performance.

No. of Terminals: 14

With a sufficient number of terminals, this product can effectively interface with other components and systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the product can function reliably in various environments without overheating.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with other devices and enables signal sharing on a common bus.

Technology: TTL

TTL technology provides high-speed and reliable operation, making the product suitable for applications that require fast data processing.

Memory IC Type: STANDARD SRAM

The use of standard SRAM ensures compatibility with a wide range of systems and applications, making this product a versatile choice.

Technical Specifications

SRAM SN7481AJ attributes and parameters. Explore more SRAM devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

Memory IC Type:

Memory Width:

1

No. of Terminals:

14

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16X1

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

SRAMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN7481AJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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