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SN74LS219AN

Texas Instruments

SN74LS219AN by Texas Instruments

SN74LS219AN by Texas Instruments is a 16x4 SRAM IC with 3-STATE output, operating in asynchronous mode. It features a temperature range of 0°C to 70°C and comes in an IN-LINE package style. Ideal for applications requiring standard SRAM memory with parallel operation.

Median Price

$10.000

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 5,515 parts In-Stock

1+ parts

$7.690

100+ parts

$5.770

1k+ parts

$5.000

10k+ parts

-

5,515

$7.690

$5.770

$5.000

-

TEDSS.com

USA . 100 parts In-Stock

1+ parts

$10.000

100+ parts

$6.990

1k+ parts

-

10k+ parts

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100

$10.000

$6.990

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-

American Microsemiconductor Inc.

USA . 5,650 parts In-Stock

1+ parts

$39.890

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5,650

$39.890

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Vyrian

USA . 8,833 parts In-Stock

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8,833

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Digiode

USA . 1,352 parts In-Stock

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1,352

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Nova Conductors

Japan . 150 parts In-Stock

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150

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ECAB

Sweden . 140 parts In-Stock

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140

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MRC Electronics

USA . 70 parts In-Stock

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70

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Inland Empire Components Inc.

USA . 31 parts In-Stock

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31

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Standard Data Resources

USA . 15 parts In-Stock

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15

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Resion

USA . 10 parts In-Stock

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10

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Manoshevitz Elec. Sales

Israel . 6 parts In-Stock

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6

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Electronic Expediters

USA . 3 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Parana Technologies

USA . 1,703 parts In-Stock

1+ parts

$4.320

100+ parts

$401.183

1k+ parts

$3.888

10k+ parts

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1,703

$4.320

$401.183

$3.888

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DigiPath Technology Company

USA . 1,100 parts In-Stock

1+ parts

$4.757

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$4.757

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ChromeModa Solutions

Germany . 6,543 parts In-Stock

1+ parts

$4.854

100+ parts

$3.980

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6,543

$4.854

$3.980

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

1+ parts

$4.854

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$4.369

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1,668

$4.854

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$4.369

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Corohmni

South Africa . 21 parts In-Stock

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$4.942

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21

$4.942

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AZTECH Wire

Italy . 405 parts In-Stock

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$14.252

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405

$14.252

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Ampacity Inc.

Singapore . 1,306 parts In-Stock

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$15.000

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1,306

$15.000

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One Stop Electronics

USA . 1,174 parts In-Stock

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$25.000

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1,174

$25.000

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Argo Parts USA

USA . 5,249 parts In-Stock

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Corphita

USA . 3,731 parts In-Stock

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3,731

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Continental Prestige Electronics

USA . 2,444 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 18 parts In-Stock

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Assy Fe

Spain . 17 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LS219AN by Texas Instruments, a high-quality SRAM memory IC that offers reliable performance and durability. Manufactured by the reputable Texas Instruments, this product is designed for various applications in the electronics industry. With its 16X4 organization and 3-STATE output characteristics, the SN74LS219AN provides customers with unmatched value and benefits. Upgrade your designs with this versatile and efficient memory IC today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the SRAM, making it reliable for long-term use.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for each memory location to be independently accessed without the need for synchronization signals, providing flexibility and efficient data retrieval.

No. of Terminals: 16

With 16 terminals, this SRAM can accommodate multiple connections and data transfers simultaneously, increasing overall efficiency and data processing speed.

Parallel or Serial: PARALLEL

Parallel data transfer allows for multiple bits to be transmitted simultaneously, resulting in faster data processing and improved performance compared to serial data transfer methods.

Technology: TTL

TTL technology ensures high-speed and reliable data transmission, making this SRAM suitable for applications that require fast and accurate data storage and retrieval.

Technical Specifications

SRAM SN74LS219AN attributes and parameters. Explore more SRAM devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Memory IC Type:

Memory Width:

4

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16X4

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Sub-Category:

SRAMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS219AN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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