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SM320C6701ZMBW14

Texas Instruments

SM320C6701ZMBW14 by Texas Instruments

Texas Instruments SM320C6701ZMBW14 is a 32-bit DSP with integrated cache, operating at max 140 MHz. Ideal for digital signal processing applications, it features 16384 RAM words, flash ROM programmability, and multiple internal bus architecture.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,722 parts In-Stock

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3,722

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Vyrian

USA . 1,943 parts In-Stock

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1,943

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Distributors (Availability)

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AZTECH Wire

Italy . 822 parts In-Stock

1+ parts

$16.401

100+ parts

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822

$16.401

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Corohmni

South Africa . 3,103 parts In-Stock

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$24.711

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3,103

$24.711

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Parana Technologies

USA . 2,324 parts In-Stock

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$29.978

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$65.499

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2,324

$29.978

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$65.499

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One Stop Electronics

USA . 1,618 parts In-Stock

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$32.000

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1,618

$32.000

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ChromeModa Solutions

Germany . 6,515 parts In-Stock

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$33.683

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$27.620

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6,515

$33.683

$27.620

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IDEA Electronic Components Group

UK . 986 parts In-Stock

1+ parts

$33.683

100+ parts

$31.999

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$30.315

10k+ parts

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986

$33.683

$31.999

$30.315

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DigiPath Technology Company

USA . 2,311 parts In-Stock

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$30.369

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2,311

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Corphita

USA . 2,246 parts In-Stock

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Microchip USA

USA . 1,246 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the SM320C6701ZMBW14 by Texas Instruments. Crafted with precision and expertise, this DSP offers unparalleled quality and reliability. Perfect for a wide range of applications, this product delivers superior performance, efficiency, and versatility. Experience seamless integration, exceptional value, and cutting-edge technology all in one package. Unlock endless possibilities and elevate your projects to new heights with the SM320C6701ZMBW14.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body materials provide durability and high temperature resistance, making the product suitable for a wide range of applications.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency, resulting in faster execution of algorithms and tasks.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.99 V

Operating at a maximum supply voltage of 1.99 V helps in reducing power consumption and heat generation, enhancing overall system reliability.

Package Shape: SQUARE

Square package shape facilitates efficient utilization of space on the circuit board, enabling compact designs in electronic devices.

Bit Size: 32

32-bit architecture allows for high precision processing of data and complex algorithms, making the product suitable for demanding signal processing tasks.

Power Supplies (V): 1.9,3.3

Operating with multiple power supply voltages provides flexibility in system design and optimization, catering to different power requirements in various applications.

No. of Terminals: 429

A high number of terminals offer connectivity options for interfacing with various external devices and peripherals, expanding the product's versatility.

Package Style (Meter): GRID ARRAY

Grid array package style enhances mechanical strength and reliability during assembly and soldering processes, ensuring secure connections and long-term durability.

Minimum Supply Voltage: 1.81 V

Operating at a minimum supply voltage of 1.81 V allows for efficient power management and performance optimization, especially in low power settings.

Maximum Operating Temperature: 115 °C

With a high maximum operating temperature of 115°C, the product can withstand harsh environmental conditions and maintain stable performance in demanding industrial applications.

No. of External Interrupts: 4

Multiple external interrupts enable the processor to respond quickly to external events, ensuring timely processing and control in real-time applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, the product remains functional in extreme cold environments, making it suitable for a wide range of temperature conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies the integration and mounting of the product onto circuit boards, enabling easier assembly processes and reducing complexity.

Maximum Seated Height: 2.7 mm

Low maximum seated height allows for compact and slim device designs, saving space and enabling sleek product aesthetics in applications with size constraints.

RAM Words: 16384

Large RAM capacity of 16384 words provides ample storage for temporary data and program instructions, supporting complex signal processing algorithms and computations.

Width: 27 mm

With a width of 27 mm, the product offers a balance between compactness and connectivity, allowing for efficient integration into various electronic systems.

Boundary Scan: YES

Boundary scan capability facilitates efficient testing and debugging of the product during manufacturing and maintenance, ensuring reliable performance and quality control.

Maximum Clock Frequency: 140 MHz

With a maximum clock frequency of 140 MHz, the product can process data and execute instructions at high speeds, meeting the demands of real-time signal processing tasks.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer efficiency within the processor, enabling simultaneous processing of multiple tasks and reducing latency.

Length: 27 mm

A length of 27 mm offers a compact form factor for the product, making it suitable for space-constrained applications without compromising on performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types allows for versatile connectivity and compatibility with a wide range of external devices, expanding the product's functionality and usability.

No. of Timers: 2

Multiple timers enable time-sensitive operations and scheduling within the processor, enhancing control and synchronization in applications that require precise timing.

Technology: CMOS

CMOS technology offers low power consumption, high speed performance, and compatibility with a broad range of applications, making the product energy-efficient and versatile.

Terminal Form: BUTT

Butt terminal form simplifies the connection and soldering process, ensuring secure and reliable electrical connections for stable operation and performance.

Nominal Supply Voltage: 1.9 V

Operating at a nominal supply voltage of 1.9 V ensures stable and efficient power delivery to the processor, optimizing performance and reliability in various operating conditions.

No. of DMA Channels: 4

Multiple DMA channels enhance data transfer efficiency and processing speed, enabling high-throughput performance and multitasking capabilities in signal processing applications.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization, ensuring adaptability to changing requirements and technological advancements.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides compatibility with standard PCB designs and components, simplifying integration and assembly processes for seamless device implementation.

Format: FLOATING POINT

Floating-point format supports high-precision mathematical calculations and complex algorithms, making the product suitable for demanding signal processing tasks that require accurate computations.

Technical Specifications

Digital Signal Processors (DSPs) SM320C6701ZMBW14 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

140 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CBGA-B429

Length:

27 mm

Low Power Mode:

NO

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

429

No. of Timers:

2

Maximum Operating Temperature:

115 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

LGA

Package Equivalence Code:

LGA429,21X21,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

2.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.99 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SM320C6701ZMBW14 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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