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OMAPL138BZWTA3

Texas Instruments

OMAPL138BZWTA3 by Texas Instruments

The Texas Instruments OMAPL138BZWTA3 is a DSP with 361 terminals, operating at 50 MHz. It features a low profile grid array package and supports boundary scan. Ideal for industrial applications requiring a floating point format and low power mode, this CMOS technology processor has a wide temperature range from -40 to 105°C.

Median Price

$32.794

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29 parts In-Stock

1+ parts

-

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$29.150

1k+ parts

$26.080

10k+ parts

$24.540

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$26.080

$24.540

DigiKey

USA . 29 parts In-Stock

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Verical

USA . 29 parts In-Stock

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$36.438

1k+ parts

$32.600

10k+ parts

$30.675

29

-

$36.438

$32.600

$30.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 685 parts In-Stock

1+ parts

$30.770

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$30.770

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DigiKey Marketplace

USA . 29 parts In-Stock

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$33.690

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29

$33.690

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Vyrian

USA . 2,964 parts In-Stock

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Bristol Electronics

USA . 17 parts In-Stock

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North Shore Components

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Inventory MP

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Semi Source

USA . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,491 parts In-Stock

1+ parts

$15.469

100+ parts

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$15.853

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1,491

$15.469

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$15.853

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DigiPath Technology Company

USA . 712 parts In-Stock

1+ parts

$17.033

100+ parts

$15.671

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712

$17.033

$15.671

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ChromeModa Solutions

Germany . 4,094 parts In-Stock

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$17.381

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$14.252

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4,094

$17.381

$14.252

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IDEA Electronic Components Group

UK . 837 parts In-Stock

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$17.381

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$16.512

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$15.643

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837

$17.381

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$15.643

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Corphita

USA . 3,916 parts In-Stock

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$29.151

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$29.151

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Corohmni

South Africa . 3,146 parts In-Stock

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$63.431

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$63.431

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Microchip USA

USA . 295 parts In-Stock

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$71.530

100+ parts

$70.290

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$69.660

10k+ parts

$69.040

295

$71.530

$70.290

$69.660

$69.040

Perfect Parts

USA . 1,680 parts In-Stock

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1,680

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Kepictronics

USA . 120 parts In-Stock

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Amble Industries

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Overview

Unlock the power of cutting-edge technology with the OMAPL138BZWTA3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers superior quality and reliability. This versatile processor is perfect for a wide range of applications, offering unmatched performance and efficiency. Experience seamless operation and advanced features that will enhance your projects and take them to the next level. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product compact and reliable for long-term use.

Surface Mount: YES

Surface mount technology makes the product easy to install on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.35 V

Operating at a maximum supply voltage of 1.35V ensures efficient power usage and protects the components from overvoltage.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, maximizing component layout flexibility.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the product can withstand harsh environmental conditions without compromising performance.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZWTA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZWTA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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