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OMAPL138BZWT4

Texas Instruments

OMAPL138BZWT4 by Texas Instruments

OMAPL138BZWT4 by Texas Instruments is a DSP with 361 terminals, operating at 0-90°C. It features a clock frequency of 50 MHz and low power mode, suitable for applications requiring floating point format and multiple internal bus architecture.

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Vyrian

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 301 parts In-Stock

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Parana Technologies

USA . 1,841 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

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$23.875

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IDEA Electronic Components Group

UK . 951 parts In-Stock

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One Stop Electronics

USA . 727 parts In-Stock

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Corohmni

South Africa . 44 parts In-Stock

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Component Stockers USA

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Overview

Experience the cutting-edge technology of Texas Instruments with the OMAPL138BZWT4 Digital Signal Processor. This versatile and high-quality product offers a wide range of applications, from industrial automation to consumer electronics. With a focus on power efficiency and performance, Texas Instruments delivers value and innovation to customers seeking advanced solutions for their projects. Trust in the expertise of the manufacturer and unlock the benefits and advantages of this state-of-the-art DSP for your next design challenge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and cost-effective solution for housing the DSP, making it easier to handle and manufacture.

Surface Mount: YES

Enables easy and efficient integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.35 V

Allows for efficient power consumption and operation within a specified voltage range.

Package Shape: SQUARE

Optimizes the use of space on the circuit board, ensuring a compact and efficient design.

Power Supplies (V): 1.2,1.8/3.3

Offers flexibility in power supply options, allowing compatibility with different voltage requirements.

No. of Terminals: 361

Provides a wide range of connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances the performance and reliability of the DSP by utilizing advanced packaging technology.

Minimum Supply Voltage: 0.95 V

Ensures stable operation even at lower voltage levels, optimizing power efficiency.

Maximum Operating Temperature: 90 °C

Allows the DSP to operate in high-temperature environments without compromising performance or reliability.

Minimum Operating Temperature: 0 °C

Ensures reliable operation in a wide range of temperature conditions, making the DSP suitable for various applications.

Terminal Finish: TIN SILVER COPPER

Provides a durable and reliable terminal finish, ensuring secure connections and long-term performance.

Terminal Position: BOTTOM

Facilitates easy installation and connection to the circuit board, simplifying the assembly process.

Maximum Seated Height: 1.4 mm

Keeps the overall profile of the DSP low, reducing the risk of interference with other components on the board.

Width: 16 mm

Maintains a compact form factor, allowing for efficient use of space on the circuit board.

Boundary Scan: YES

Enables comprehensive testing and debugging capabilities, ensuring the reliability and performance of the DSP.

Maximum Clock Frequency: 50 MHz

Provides fast processing speeds, making the DSP suitable for applications that require real-time signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering of the DSP during assembly, preventing damage to the component.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during the soldering process, ensuring the integrity of the DSP.

Internal Bus Architecture: MULTIPLE

Enhances the data processing capabilities of the DSP, enabling efficient communication within the device.

Length: 16 mm

Maintains a square form factor, ensuring a uniform and compact design for the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a wide range of peripherals and interfaces, making the DSP versatile for various applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed processing, enhancing the efficiency of the DSP.

Terminal Form: BALL

Provides a reliable and robust terminal form, ensuring secure connections and long-term performance.

Nominal Supply Voltage: 1 V

Optimizes power efficiency by operating at a standard voltage level, ensuring compatibility with different power sources.

Terminal Pitch: 0.8 mm

Offers a fine pitch for terminals, enabling high density integration and efficient signal routing on the circuit board.

Format: FLOATING POINT

Supports floating-point calculations for accurate and precise signal processing, making the DSP suitable for complex algorithms.

Moisture Sensitivity Level (MSL): 3

Provides protection against moisture damage, ensuring the reliability and longevity of the DSP in humid conditions.

Low Power Mode: YES

Includes a low power mode for efficient power management, maximizing battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZWT4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZWT4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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