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OMAPL138BZCED4E

Texas Instruments

OMAPL138BZCED4E by Texas Instruments

OMAPL138BZCED4E by Texas Instruments is a DSP with 361 terminals, operating at a max clock frequency of 50 MHz. It features low power mode and CMOS technology, making it ideal for applications requiring high-speed digital signal processing in compact form factors. With a package style of grid array and fine pitch, this processor is suitable for space-constrained designs where power efficiency is crucial.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,160 parts In-Stock

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Digiode

USA . 4,746 parts In-Stock

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4,746

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Distributors (Availability)

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Andel Nordic

Denmark . 1,641 parts In-Stock

1+ parts

$2.499

100+ parts

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$2.399

10k+ parts

$2.399

1,641

$2.499

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$2.399

$2.399

AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$9.344

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664

$9.344

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Parana Technologies

USA . 870 parts In-Stock

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$14.837

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$15.268

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870

$14.837

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$15.268

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One Stop Electronics

USA . 647 parts In-Stock

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$16.000

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647

$16.000

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DigiPath Technology Company

USA . 829 parts In-Stock

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$16.338

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829

$16.338

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

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$16.671

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$15.837

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$15.004

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1,546

$16.671

$15.837

$15.004

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ChromeModa Solutions

Germany . 1,476 parts In-Stock

1+ parts

$16.671

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$13.670

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1,476

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$13.670

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Corohmni

South Africa . 224 parts In-Stock

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$53.739

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224

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Component Stockers USA

USA . 290 parts In-Stock

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$99.990

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290

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,361 parts In-Stock

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Corphita

USA . 995 parts In-Stock

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995

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Microchip USA

USA . 107 parts In-Stock

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Perfect Parts

USA . 63 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments OMAPL138BZCED4E Digital Signal Processor. This high-quality product offers unmatched precision and performance, making it a top choice for a wide range of applications. With Texas Instruments' reputation for innovation and reliability, you can trust that this DSP will exceed your expectations. Experience the value and benefits of seamless operation, efficient power management, and unparalleled speed. Elevate your projects to new heights with the OMAPL138BZCED4E and discover the advantages of superior processing capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and cost-effective material for the package body.

Surface Mount: YES

Ease of mounting and soldering onto PCBs.

Maximum Supply Voltage: 1.35 V

Allows for flexibility in power supply options.

Package Shape: SQUARE

Compact and efficient use of space on the PCB.

Power Supplies (V): 1.2,1.8/3.3

Ability to work with various power supply voltages.

No. of Terminals: 361

Provides a high level of connectivity and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

High-density packaging for increased performance.

Minimum Supply Voltage: 0.95 V

Operational at lower voltage levels for power efficiency.

Terminal Finish: TIN SILVER COPPER

Durable and corrosion-resistant terminal finish.

Terminal Position: BOTTOM

Allows for easier PCB routing and component placement.

Maximum Seated Height: 1.3 mm

Low-profile design for space-constrained applications.

Width: 13 mm

Compact size for efficient use of board space.

Boundary Scan: YES

Facilitates testing and debugging of the DSP.

Maximum Clock Frequency: 50 MHz

High clock frequency for fast signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly.

Internal Bus Architecture: MULTIPLE

Efficient data transfer within the chip for improved performance.

Length: 13 mm

Compact form factor for space-saving designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile in functionality for diverse applications.

Technology: CMOS

Low power consumption and high integration capabilities.

Terminal Form: BALL

Reliable and secure terminal connection.

Nominal Supply Voltage: 1 V

Stable voltage supply for consistent performance.

Terminal Pitch: 0.65 mm

Fine pitch for high-density board layouts.

Format: FLOATING POINT

Suitable for complex mathematical computations.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture-related damage during handling and storage.

Low Power Mode: YES

Energy-efficient operation for extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZCED4E attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZCED4E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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