Loading...

OMAPL138BZCED4

Texas Instruments

OMAPL138BZCED4 by Texas Instruments

OMAPL138BZCED4 by Texas Instruments is a DSP with 361 terminals, operating at max 50 MHz. It features low power mode and boundary scan, suitable for industrial applications requiring high-speed processing in compact form factor. With a supply voltage range of 0.95-1.35 V, it offers efficient performance in various digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,449

-

-

-

-

Sensible Micro Corp

USA . 790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

790

-

-

-

-

Digiode

USA . 269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

269

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,327 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,327

$9.000

-

-

-

AZTECH Wire

Italy . 196 parts In-Stock

1+ parts

$18.981

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$18.981

-

-

-

Ampacity Inc.

Singapore . 1,600 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

$29.000

-

-

-

Parana Technologies

USA . 2,376 parts In-Stock

1+ parts

$74.823

100+ parts

-

1k+ parts

-

10k+ parts

-

2,376

$74.823

-

-

-

Corohmni

South Africa . 47 parts In-Stock

1+ parts

$76.824

100+ parts

-

1k+ parts

-

10k+ parts

-

47

$76.824

-

-

-

DigiPath Technology Company

USA . 1,772 parts In-Stock

1+ parts

$82.390

100+ parts

$75.798

1k+ parts

-

10k+ parts

-

1,772

$82.390

$75.798

-

-

ChromeModa Solutions

Germany . 4,190 parts In-Stock

1+ parts

$84.071

100+ parts

$68.938

1k+ parts

-

10k+ parts

-

4,190

$84.071

$68.938

-

-

IDEA Electronic Components Group

UK . 2,246 parts In-Stock

1+ parts

$84.071

100+ parts

$79.867

1k+ parts

$75.664

10k+ parts

-

2,246

$84.071

$79.867

$75.664

-

A-Z Elektronik GmbH

Germany . 6,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,782

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,301

-

-

-

-

Corphita

USA . 2,047 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,047

-

-

-

-

ChipstoGo Electronic ltd

UK . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

480

-

-

-

-

Perfect Parts

USA . 474 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

474

-

-

-

-

Microchip USA

USA . 465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

465

-

-

-

-

Kepictronics

USA . 320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

320

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the OMAPL138BZCED4 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unmatched quality and reliability. This versatile device is perfect for a wide range of applications, providing customers with exceptional value and performance. Experience seamless operation and high-speed processing without compromising on efficiency. Trust Texas Instruments to bring innovation and excellence to your projects with the OMAPL138BZCED4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good physical protection and heat dissipation, ensuring durability and reliable performance.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.35 V

Optimal voltage supply for efficient power usage and performance.

Package Shape: SQUARE

Square shape allows for compact and space-saving design in electronic devices.

Power Supplies (V): 1.2,1.8/3.3

Provides flexibility in power supply options to accommodate various voltage requirements.

No. of Terminals: 361

High number of terminals allow for more connectivity options and features.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch design contribute to high-density integration and efficient signal processing.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage for energy efficiency and low power consumption.

Maximum Operating Temperature: 90 °C

High operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions without compromising functionality.

Terminal Finish: TIN SILVER COPPER

Tin silver copper finish offers excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easy PCB layout and soldering for efficient assembly.

Maximum Seated Height: 1.3 mm

Low seated height contributes to a compact design and space-saving layout in electronic devices.

Width: 13 mm

Narrow width allows for integration in tight spaces or densely populated PCBs.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during development and production.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for fast signal processing and efficient operation in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures safe and reliable soldering process during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component bonding for reliable performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and processing speed for optimal performance.

Length: 13 mm

Compact length contributes to a space-saving design and easy integration into electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures robust performance in harsh operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type enables various signal processing functions and additional features for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability for efficient signal processing.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable contact with the PCB for stable performance.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation of the DSP.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density integration and efficient signal routing on the PCB.

Format: FLOATING POINT

Floating-point format enables precise and accurate mathematical computations for digital signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard handling and storage conditions.

Low Power Mode: YES

Low power mode option allows for energy-efficient operation and extended battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZCED4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

OMAPL138BZCED4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20